Search Results - "Landesberger, Christof"

Six-layer lamination of a new dry film negative-tone photoresist for fabricating complex 3D microfluidic devices by El Hasni, Akram, Pfirrmann, Stefan, Kolander, Anett, Yacoub-George, Erwin, König, Martin, Landesberger, Christof, Voigt, Anja, Grützner, Gabi, Schnakenberg, Uwe

“…We present a new epoxy-based negative-tone dry film photoresist (DFR) for fabricating multilayer microfluidic devices using a lamination process combined with…”
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Analysis of wafer bonding by infrared transmission by BOLLMANN, D, LANDESBERGER, C, RAMM, P, HABERGER, K

“…In solid state technology, two silicon wafers can be combined by wafer bonding. Small particles between the two surfaces may cause voids. For quality control,…”
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Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process by Bose, Indranil, Palavesam, Nagarajan, Hochreiter, Christian, Landesberger, Christof, Kutter, Christoph

“…Here we report on a flexible, foil based packaging process in which a standard commercially available MEMS capacitive air pressure sensor is packaged in an…”
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Investigations of the influence of dicing techniques on the strength properties of thin silicon by Schoenfelder, Stephan, Ebert, Matthias, Landesberger, Christof, Bock, Karlheinz, Bagdahn, Jörg

“…Thin silicon offers a variety of new possibilities in microelectronical, solar and micromechanical industries, e.g. for 3D-integration (stacked dies), thin…”
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Roll-to-roll hot embossing of microstructures by Velten, Thomas, Bauerfeld, Frank, Schuck, Herbert, Scherbaum, Sabine, Landesberger, Christof, Bock, Karlheinz

“…In this paper we present a new roll-to-roll embossing process allowing the replication of micro patterns with feature sizes down to 0.5 μm. The embossing…”
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Selective one-step plasma patterning process for fluidic self-assembly of silicon chips by Bock, K., Scherbaum, S., Yacoub-George, E., Landesberger, C.

“…Applying a tetrafluoromethane (CF 4 ) low pressure plasma process to the surface of a polymeric foil with a structured thin film copper layer on top results in…”
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Biomolecular self-assembly of micrometer sized silica beads on patterned glass substrates by Alberti, Martin, Yacoub-George, Erwin, Hell, Waltraud, Landesberger, Christof, Bock, Karlheinz

“…A self-assembly process for the two-dimensional arrangement of micrometer sized silica beads on glass slides was developed. It is based on the hybridization of…”
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Advanced integration technology for fabricating high-speed electro-optical sub-assembly by Palavesam, Nagarajan, Choi, Jung Han, Hell, Waltraud, Fiol, Gerrit, Velthaus, Karl-Otto, Zerna, Conrad, Gieser, Horst, Landesberger, Christof

“…Here, we report flip-chip bonding processes based on Anisotropic Conductive Film (ACF) and Sn-Ag-Cu (SAC) solder implemented for bonding three test chips (two…”
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Investigations of the fracture strength of thin silicon dies embedded in flexible foil substrates by Palavesam, Nagarajan, Landesberger, Christof, Bock, Karlheinz

“…Mechanical stress induced by mechanical and thermal loading on thin silicon devices breaks the devices at a certain load called the fracture or breaking…”
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Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration by Ramm, Peter, Klumpp, Armin, Landesberger, Christof, Weber, Josef, Heinig, Andy, Schneider, Peter, Elst, Guenter, Engelhardt, Manfred

“…Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a…”
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Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates by Palavesam, Nagarajan, Landesberger, Christof, Kutter, Christoph, Bock, Karlheinz

“…We report a Finite Element Model to calculate the bending stress of thin and ultra-thin silicon dies embedded in flexible foil substrates (chip-in-foil…”
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Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending by Palavesam, Nagarajan, Bonfert, Detlef, Hell, Waltraud, Landesberger, Christof, Gieser, Horst, Kutter, Christoph, Bock, Karlheinz

“…We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending…”
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Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration by Landesberger, Christof, Scherbaum, Sabine, Weber, Josef, Bock, Karlheinz, Hiroshima, Mitsuru, Oberhofer, Bernhard

“…Thin silicon chips with a thickness of 50 μm are of light weight and are able to swim on droplets of fluids like for instance water. If the liquid shows a…”
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Broadband interconnect design for silicon-based system-in-package applications up to 170 GHz by Topak, Eray, Joo-Young Choi, Merkle, Thomas, Koch, Stefan, Saito, Shin, Landesberger, Christof, Faul, Robert, Bock, Karlheinz

“…This paper presents the design of vertical chip-to-chip interconnects for mm-wave system-in-package (SiP) applications up to 170 GHz. Solid and liquid type…”
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Roll-to-roll hot embossing of microstructures by Velten, Thomas, Bauerfeld, Frank, Schuck, Herbert, Scherbaum, Sabine, Landesberger, Christof, Bock, Karlheinz

“…In this paper we present a new roll-to-roll embossing process allowing the replication of micro patterns with feature sizes down to 0.5 μm. The embossing…”
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Polymer opto-electronic-fluidic detection module on plastic film substrates by Ohlander, A., Burghart, M., Strohhofer, C., Bollmann, D., Landesberger, C., Klink, G., Bock, K.

“…This paper presents a multi-functional operational diagnostic lab-on-foil analysis system integrating electrical and optical devices by polytronic means. This…”
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Investigations of strength properties of ultra-thin silicon by Schonfelder, S., Bagdahn, J., Ebert, M., Petzold, M., Bock, K., Landesberger, C.

“…Thin silicon offers a variety of new possibilities in microelectronical and micromechanical industries, e.g. for 3D-integration (stacked dice) or…”
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Chip-in-polymer: volumetric packaging solution using PCB technology by Jung, E., Wojakowski, D., Neumann, A., Landesberger, C., Ostmann, A., Aschenbrenner, R., Reichl, H.

“…The new challenge is to incorporate not only passive components, but as well active circuitry (ICs) and the necessary thermal management. Ultra thin chips…”
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