Search Results - "Lakhera, Nishant"

Effect of viscoelasticity on the spherical and flat adhesion characteristics of photopolymerizable acrylate polymer networks by Lakhera, Nishant, Graucob, Annalena, Schneider, Andreas S., Kroner, Elmar, Arzt, Eduard, Yakacki, Christopher M., Frick, Carl P.

“…This research is the first of its kind to study the comparison between spherical and flat probe adhesion behavior as a function of viscoelasticity…”
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Characterization of poly(para-phenylene)-MWCNT solvent-cast composites by A. Brinckmann, Stephan, Lakhera, Nishant, M. Laursen, Chris, Yakacki, Christopher, P. Frick, Carl

“…Poly(para-phenylene) (PPP) is one of the strongest and stiffest thermoplastic polymers due to its aromatic backbone structure. However, because of this…”
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Characterization of indentation size effects in epoxy by Alisafaei, F., Han, Chung-Souk, Lakhera, Nishant

“…Nanoindentation tests were conducted at different indentation depths, ranging from 3000 to 30 nm, to study the characteristics of indentation size effects in…”
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Modeling the glass transition of amorphous networks for shape-memory behavior by Xiao, Rui, Choi, Jinwoo, Lakhera, Nishant, Yakacki, Christopher M., Frick, Carl P., Nguyen, Thao D.

“…In this paper, a thermomechanical constitutive model was developed for the time-dependent behaviors of the glass transition of amorphous networks. The model…”
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Partially constrained recovery of (meth)acrylate shape-memory polymer networks by Lakhera, Nishant, Yakacki, Christopher M., Nguyen, Thao. D., Frick, Carl P.

“…The purpose of this study was to characterize the partial strain recovery of a thermoset shape‐memory polymer under a constraining stress. Three polymer…”
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Biodegradable thermoset shape-memory polymer developed from poly(β-amino ester) networks by Lakhera, Nishant, Laursen, Christopher M., Safranski, David L., Frick, Carl P.

“…The purpose of this study was to develop a degradable thermoset shape‐memory polymer from poly(β‐amino ester) (PBAE) networks. PBAE was chosen to be the…”
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Systematic tailoring of water absorption in photopolymerizable (meth)acrylate networks and its effect on mechanical properties by Lakhera, Nishant, Smith, Kathryn E., Frick, Carl P.

“…Photopolymerizable (meth)acrylate networks offer several advantages as biomedical materials including their ability to be formed in situ, fast synthesis rates,…”
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On thresholds in the indentation size effect of polymers by Bucsek, Ashley N., Alisafaei, Farid, Han, Chung-Souk, Lakhera, Nishant

“…Length scale-dependent deformation in polymers has been observed by various research groups in the last years. Here, the indentation size effect of polymers is…”
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Amorphous-to-crystalline transition of Polyetheretherketoneacarbon nanotube composites via resistive heating by Martin, Alicia, Lakhera, Nishant, DiRienzo, Amy, Safranski, David, Schneider, Andreas, Yakacki, Christopher, Frick, Carl

“…The purpose of this study was to investigate increasing crystalline structure in polyetheretherketone (PEEK) via resistive heating. Multi-walled carbon…”
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Thermo-mechanical behavior and structure of melt blown shape-memory polyurethane nonwovens by Safranski, David L., Boothby, Jennifer M., Kelly, Cambre N., Beatty, Kyle, Lakhera, Nishant, Frick, Carl P., Lin, Angela, Guldberg, Robert E., Griffis, Jack C.

“…New processing methods for shape-memory polymers allow for tailoring material properties for numerous applications. Shape-memory nonwovens have been previously…”
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Amorphous-to-crystalline transition of Polyetheretherketone–carbon nanotube composites via resistive heating by Martin, Alicia C., Lakhera, Nishant, DiRienzo, Amy L., Safranski, David L., Schneider, Andreas S., Yakacki, Christopher M., Frick, Carl P.

“…The purpose of this study was to investigate increasing crystalline structure in polyetheretherketone (PEEK) via resistive heating. Multi-walled carbon…”
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Unique Recovery Behavior in Amorphous Shape-Memory Polymer Networks by Yakacki, Christopher M., Ortega, Alicia M., Frick, Carl P., Lakhera, Nishant, Xiao, Rui, Nguyen, Thao D.

“…Shape‐memory polymers (SMPs) have emerged as a multi‐functional materials platform and have been proposed for a variety of applications ranging from simple…”
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Repassivation behaviour of stressed aluminium electrodes in aqueous chloride solutions by Mi, Changwen, Lakhera, Nishant, Kouris, Demitris A., Buttry, Daniel A.

“…► We studied the combined influence of stress and chloride on aluminium electrodes. ► We performed both experiments and electrochemical repassivation…”
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Development and characterization of amorphous acrylate networks for use as switchable adhesives inspired from shapememory behavior by Lakhera, Nishant

“…Several types of insects and animals such as spiders and geckos are inherently able to climb along vertical walls and ceilings. This remarkable switchable…”
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Analysis of Thin Flip Chip Chip-Scale Package Warpage Causes and Variations by Foong, CS, Afripin, Amirul, Lakhera, Nishant, Uehling, Trent

“…The objective of this paper is to present results of an investigation on variations in materials properties, package designs, and assembly processes affecting…”
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Copper Pillar Voids in a Flip Chip Package During High Temperature Application by Wang, Miao, Mavinkurve, Amar, Roucou, Romuald, Afripin, Amirul, Uehling, Trent, Foong, Cs, Lakhera, Nishant

“…This paper presents the results of a set of designed experiments for the purpose of evaluating the dependencies of solder voids on different factors related to…”
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Deformation and repassivation of aluminum electrodes under bending in aqueous solutions by Lakhera, Nishant

“…Pitting corrosion has been identified as the most frequent cause of failure of aluminum and its alloys which are used extensively by the US Airforce. The role…”
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Challenges of Scaling Down High-Power Performance Flip Chip Ball Grid Array (FCBGA) Package by Chan, W H, Lakhera, Nishant, Uehling, Trent, Bharatham, Logendran, Shantaram, Sandeep, Sukemi, Azham Mohd

“…As the demand for miniaturization and cost reduction in microelectronic products continues to rise, there is a growing need for semiconductor packages that can…”
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Board Level Reliability of Automotive Grade WLCSP for Radar Applications by Lakhera, Nishant, Carpenter, Burt, Duong, Trung, Benson, Mollie, Mawer, Andrew J

“…Wafer-Level Chip Scale Packages (WLCSPs) are becoming commonplace in the industry due to their small form factor. Applications include industrial and…”
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Deformation and repassivation of aluminum electrodes under bending in aqueous solutions by Lakhera, Nishant

“…Pitting corrosion has been identified as the most frequent cause of failure of aluminum and its alloys which are used extensively by the US Airforce. The role…”
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