Search Results - "Lahri, R."
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1
Gate oxide charge-to-breakdown correlation to MOSFET hot-electron degradation
Published in IEEE electron device letters (01-04-1988)“…Substrate current by itself is found not to be a sufficient indicator of degradation. Experiments using active-area test capacitors with and without poly edges…”
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2
Potential distributions in metal-Semiconductor and p-i-n structures on a-Si:H by capacitive techniques
Published in IEEE transactions on electron devices (01-05-1982)“…C(0),f and C-V-f characteristics have been used to find the barrier profile and depletion width in several Schottky (i-n + ) structures on a-Si: H. Depletion…”
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3
Image force effects on carrier collection in a -Si:H solar cells
Published in Applied physics letters (15-08-1981)“…A modified carrier collection model of a-Si:H Schottky-barrier solar cells is proposed to explain the falloff of short wavelength carrier collection…”
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4
Effects of the undoped layer on characteristics of amorphous silicon Schottky diodes
Published in IEEE electron device letters (01-08-1981)“…The effects of undoped layer thickness on the dark and illuminated I-V characteristics of hydrogenated amorphous silicon Schottky barrier solar cells are…”
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5
Improving hot-electron reliability through circuit analysis and design
Published in 29th Annual Proceedings Reliability Physics 1991 (1991)“…On-chip hot-electron test/stress structures have been developed. These structures provide insight into device degradation under real circuit operation. This…”
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6
Submicron Large-Angle-Tilt Implanted Drain technology for mixed-signal applications
Published in Proceedings of 1994 IEEE International Electron Devices Meeting (1994)“…This paper reports the use of LATID in submicron MOS technology to improve both analog and digital device performance and reliability. It is demonstrated that…”
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7
Mismatch drift: a reliability issue for analog MOS circuits
Published in 30th Annual Proceedings Reliability Physics 1992 (1992)“…Mismatch drift is a major process reliability issue for analog and mixed-signal designs. Mismatch stability was examined for a 0.8- mu m CMOS process using a…”
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8
Development of design rules for reliable tungsten plugs using simulations
Published in 30th Annual Proceedings Reliability Physics 1992 (1992)“…Design rules for the fabrication of reliable tungsten via plugs, produced using blanket tungsten deposition and etch-back, have been developed using…”
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9
Ion beam shadowing effect in submicromometer large-angle-tilt implanted drain (latid) MOSFETs
Published in Solid-state electronics (1995)Get full text
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10
Ion beam shadowing effect in submicrometer large-angle-tilt implanted drain (LATID) MOSFETs
Published in Solid-state electronics (01-07-1995)“…An orientation-dependent device characteristic in LATID MOSFETs is reported. By controlled device fabrication splits, it is confirmed that the…”
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11
Analog characteristics of drain engineered submicron MOSFETs for mixed-signal applications
Published in Solid-state electronics (1995)“…Drain engineered MOSFETs are compared in terms of their impact on analog performance for submicron mixed-signal applications. The high energy implanted lightly…”
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12
Poly emitter bipolar hot carrier effects in an advanced BiCMOS technology
Published in 1987 International Electron Devices Meeting (1987)“…Hot carrier effects due to reverse biasing of emitter-base junction in a poly emitter bipolar transistor are discussed. Degradation of transistor current gain…”
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13
Characterization of transistor mismatch for statistical CAD of submicron CMOS analog circuits
Published in 1993 IEEE International Symposium on Circuits and Systems (ISCAS) (01-05-1993)“…The use of a four-parameter MOS model to characterize drain current mismatch is discussed. Guidelines for the accurate and repeatable measurement of transistor…”
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14
Characterization and optimization of amorphous silicon solar cells by variation of device geometry
Published in 1982 International Electron Devices Meeting (1982)“…Characteristics of N-I-P hydrogenated amorphous silicon solar cells have been studied systematically by varying the thickness of each layer. Open circuit…”
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15
0.6 μm, single poly advanced BiCMOS (ABiC IV) technology for ASIC applications
Published in Digest of Technical Papers.1990 Symposium on VLSI Technology (1990)“…An advanced BiCMOS technology (ABiC IV), developed by integration of high-performance CMOS devices with a state of the art bipolar process, is presented. The…”
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16
Transient substrate current effects on n-channel MOSFET device lifetime
Published in Technical Digest., International Electron Devices Meeting (1988)“…The n-channel MOSFET transient substrate current during dynamic hot-carrier stressing has been found to be a strong function of the rise and fall time of the…”
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17
A 2.5 ns ECL 1616 multiplier
Published in IEEE Proceedings of the Custom Integrated Circuits Conference (1990)“…A 16*16 b integer multiplier is described that has achieved a measured delay of less than 2.5 ns, register to register, for a full 16*16 multiply. It was…”
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18
An optimized gate oxide breakdown test by activating oxide traps at low fields
Published in 1992 International Technical Digest on Electron Devices Meeting (1992)“…In this paper, an optimized current ramp charge to breakdown test is evaluated. This methodology is more sensitive to oxide defects than the JEDEC recommended…”
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19
Poly emitter bipolar transistor optimization for an advanced BiCMOS technology
Published in Proceedings of the 1988 Bipolar Circuits and Technology Meeting (1988)“…Two approaches involving phosphorus- and arsenic-doped poly emitters for bipolar device optimization in a 1 mu m BiCMOS process are reported. An evaluation…”
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20
Submicron BiCMOS technologies for supercomputer and high speed system implementation
Published in Proceedings., 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors (1990)“…Submicron process technologies that allow a full implementation of CPU, first-level cache, second-level cache, and the main memory in the BiCMOS approach are…”
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