Photo-assisted metallisation: line resolution studies

Photo-assisted metallisation: line resolution studies

Photo-activation processes for electroless plating have the potential for linewidth resolution on a scale of the order of 10 μm or less, depending on the substrate surface morphology and plating conditions. This work presents the first AFM and linewidth resolution study of insulating substrates sele...

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Bibliographic Details
Published in:Surface & coatings technology Vol. 100; pp. 80 - 84
Main Authors: Lafferty, E.J., Macauley, D.J., Mongey, K.F., Kelly, P.V., Crean, G.M.
Format: Journal Article
Language:English
Published: Elsevier B.V 01-03-1998
Subjects:
Line resolution
Metallisation
Metallisation
Line resolution
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Description
Summary:Photo-activation processes for electroless plating have the potential for linewidth resolution on a scale of the order of 10 μm or less, depending on the substrate surface morphology and plating conditions. This work presents the first AFM and linewidth resolution study of insulating substrates selectively activated using a purpose-built KrCl * excimer lamp contact mask aligner with proprietary photochemical activation precursors having optimum photoactivity at the excimer lamp wavelength. The surface morphology of a photodefined activation layer on ceramics of varying surface topography, and on highly orientated pyrolytic graphite (HOPG), was investigated using atomic force microscopy. The subsequent nucleation and growth of the electroless metallisation on 96% alumina were also studied. The minimum achievable resolution of the subsequent electroless copper metallisations on alumina ceramic substrates is evaluated.
ISSN:0257-8972
1879-3347
DOI:10.1016/S0257-8972(97)00592-6