Search Results - "Ladani, Leila J."

Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits by Ladani, Leila J.

“…Three-dimensional integrated circuit (3D IC) is a promising technology in today’s IC packaging industry. Since the technology is in infancy stages, many…”
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Stress analysis of 3-dimensional IC package as function of structural design parameters by Ladani, Leila J.

“…Solid Liquid Inter-Diffusion (SLID) is a technology that has recently been utilized to fabricate 3D ICs. Since application of this technology is in its infancy…”
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A meso-scale damage evolution model for cyclic fatigue of viscoplastic materials by Ladani, Leila J., Dasgupta, Abhijit

“…This study presents an approach to predict the degree of material degradation and the resulting changes in elastic, plastic and creep constitutive properties…”
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Microstructure and mechanical strength of snag-based solid liquid inter-diffusion bonds for 3 dimensional integrated circuits by Ladani, Leila J., Razmi, Jafar, Bentley, Jordan

“…Solid liquid inter-diffusion is a bonding technology that has been proposed at microscale for fabrication of ultrafine interconnects in high density and 3…”
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An anisotropic mechanical fatigue damage evolution model for Pb-free solder materials by Ladani, Leila J., Razmi, Jafar

“…Evaluating state of damage in a ductile material as it experiences mechanical fatigue and cyclic loading poses much complexity, and has been the subject of…”
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Effect of Selected Process Parameters on Durability and Defects in Surface-Mount Assemblies for Portable Electronics by Ladani, L.J., Dasgupta, A., Cardoso, I., Monlevade, E.

“…This paper presents a systematic approach to study the effect of manufacturing variables on the creation of defects and the effect of those defects on the…”
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Damage initiation and propagation modeling using Energy Partitioning Damage Evolution model for Pb-free solder materials by Ladani, Leila J

“…Thermo-mechanical fatigue and damage has always been an issue for solder joint materials used in micro-electronic devices. Accurate prediction of the damage…”
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Probabilistic Design Approach for Cyclic Fatigue Life Prediction of Microelectronic Interconnects by Ladani, Leila J, Razmi, Jafar

“…Deterministic approaches may predict the life of solder joint interconnects used in microelectronic devices far different from the test results and field…”
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IMC growth in solid-liquid interdifussion bonds by Ladani, Leila J, Razmi, Jafar

“…3D ICs is a promising new technology that has many advantages over traditional planar packages. To take advantage of this technology, new bonding techniques…”
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Stochastic finite element modeling of fatigue damage evolution for visco-plastic materials in micro-electronics by Ladani, Leila J, Razmi, Jafar

“…Thermo-mechanical fatigue is one of the main failure mechanisms of solder joints in electronic devices. Deterministic approaches that are typically used to…”
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Reliability estimation for large-area solder joints using explicit modeling of damage by Ladani, L.J.

“…The issues of available cyclic fatigue models in life prediction of large-area solder joints using finite-element analysis (FEA) are discussed. In this paper,…”
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Interaction Effect of Voids and Standoff Height on Thermomechanical Durability of BGA Solder Joints by Ladani, L.J., Razmi, J.

“…This paper documents simulation studies on the interactive effect of standoff height and void volume on the thermomechanical durability of ball-grid-array…”
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