Search Results - "LOHE, Ch"
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1
The role of the HfO2―TiN interface in capacitance―voltage nonlinearity of Metal-Insulator-Metal capacitors
Published in Thin solid films (01-10-2009)Get full text
Conference Proceeding Journal Article -
2
The role of the HfO(2)-TiN interface in capacitance-voltage nonlinearity of Metal-Insulator-Metal capacitors
Published in Thin solid films (01-10-2009)“…The high-k Metal-Insulator-Metal (MIM) capacitor Back-End-of-Line (BEOL) integration into mixed signal and Radio Frequency (RF) circuits is characterized by…”
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Journal Article -
3
The role of the HfO 2–TiN interface in capacitance–voltage nonlinearity of Metal-Insulator-Metal capacitors
Published in Thin solid films (2009)“…The high-k Metal-Insulator-Metal (MIM) capacitor Back-End-of-Line (BEOL) integration into mixed signal and Radio Frequency (RF) circuits is characterized by…”
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Journal Article -
4
Investigation of atomic vapour deposited TiN/HfO2/SiO2 gate stacks for MOSFET devices
Published in Microelectronic engineering (01-08-2008)“…HfO2 films were grown by atomic vapour deposition (AVD) on SiO2/Si (1 0 0) substrates. The positive shift of the flat band voltage of the HfO2 based…”
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Journal Article -
5
Investigation of atomic vapour deposited TiN/HfO 2/SiO 2 gate stacks for MOSFET devices
Published in Microelectronic engineering (2008)“…HfO 2 films were grown by atomic vapour deposition (AVD) on SiO 2/Si (1 0 0) substrates. The positive shift of the flat band voltage of the HfO 2 based…”
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Journal Article -
6
Atomic -vapour -deposited HfO2 and Sr4Ta2O9 layers for metal-insulator-metal applications
Published in Microelectronic engineering (01-09-2007)“…Sr4Ta2O9 and HfO2 films were prepared on 200 mm TiN/Si(100) substrates by Atomic Vapour Deposition (AVD). Depositions were carried out within a thermal budget…”
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Conference Proceeding Journal Article -
7
Atomic - vapour - deposited HfO 2 and Sr 4Ta 2O 9 layers for metal-insulator-metal applications
Published in Microelectronic engineering (2007)“…Sr 4Ta 2O 9 and HfO 2 films were prepared on 200 mm TiN/Si(100) substrates by Atomic Vapour Deposition (AVD). Depositions were carried out within a thermal…”
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Journal Article