Search Results - "LO, Jeffery C. C."
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1
Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing
Published in Polymers (16-01-2023)“…The inkjet printing method is a promising method to deposit polymer and functional nanoparticles at the microscale. It can be applied in the fabrication of…”
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Journal Article -
2
Characterization and Evaluation of 3D-Printed Connectors for Microfluidics
Published in Micromachines (Basel) (26-07-2021)“…3D printing is regarded as a useful tool for the fabrication of microfluidic connectors to overcome the challenges of time consumption, clogging, poor…”
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Journal Article -
3
Lens Forming by Stack Dispensing for LED Wafer Level Packaging
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-01-2015)“…In this paper, a moldless stack dispensing method to form an light-emitting diode (LED) lens at the wafer level is presented. This method uses a dispensing…”
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Journal Article -
4
An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-08-2016)“…Transcorneal electrical stimulation (TcES) is one of the potential therapies to prevent retinal degeneration. This study reports on an implantable medical…”
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Journal Article -
5
UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars
Published in Journal of microelectromechanical systems (01-12-2020)“…Ultraviolet (UV) assisted printing has emerged as a promising additive manufacturing (AM) technology, which puts UV light sources with focused emission in high…”
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Journal Article -
6
The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-05-2019)“…While highly thermally conductive underfill material has been proposed as a solution for reducing the thermal resistance of flip-chip light-emitting diode…”
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Journal Article -
7
Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-03-2019)“…Light-emitting diode (LED) devices depend strongly on proper thermal management to mitigate negative effects caused by high operating temperature, especially…”
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Journal Article -
8
A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer
Published in IEEE electron device letters (01-03-2023)“…The design of a thin-film spiral inductor with multi-fin structure on a flexible substrate is proposed that can be used in a fully integrated wireless power…”
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Journal Article -
9
Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-08-2015)“…This paper introduces a through-silicon-via (TSV) dispensing approach to accomplish the underfill process without a conventional reservoir. The vias function…”
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Journal Article -
10
Reliability study of surface mount printed circuit board assemblies with lead-free solder joints
Published in Soldering & surface mount technology (01-01-2008)“…Purpose - The purpose of this paper is to evaluate the lead-free solder joint reliability of a variety of surface mount components assembled onto printed…”
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Journal Article -
11
Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11-09-2023)“…Microfluidics has attracted significant attention for biological applications, particularly for high-throughput screening and multiplexing. However,…”
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Conference Proceeding -
12
Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints
Published in 2022 International Conference on Electronics Packaging (ICEP) (11-05-2022)“…Inkjet printing has been studied as one of the potential complements to conventional photolithography for low-cost and rapid prototyping. Different functional…”
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Conference Proceeding -
13
Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die Stacking
Published in 2021 IEEE 16th Nanotechnology Materials and Devices Conference (NMDC) (12-12-2021)“…Smaller thermal resistance between stacked chips will help reduce the junction temperature of 3D integrated circuit (3D-IC) under the same operating condition…”
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Conference Proceeding -
14
Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…Additive manufacturing has been extensively studied as a promising candidate for complete or partial replacement of traditional photolithography methods. The…”
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Conference Proceeding -
15
Inkjet Printing High Resolution Polydimethylsiloxane Dots Array
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…Inkjet printing polydimethylsiloxane (PDMS) has gain attention in the development of quantum dots light emitting diodes (QLEDs), color conversion layers,…”
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Conference Proceeding -
16
A UVC LED Disinfection Closet for Reuse of Protective Coats
Published in 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (10-08-2022)“…A closet featured with 1 minute disinfection time was developed for high efficient disinfection of protective coats. An ultraviolet-C light-emitting diode (UVC…”
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Conference Proceeding -
17
Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance
Published in 2023 International Conference on Electronics Packaging (ICEP) (19-04-2023)“…Quantum dot (QD) color conversion (QDCC) film with monochrome excitation backlight is a promising way to implement mini/micro-LED displays. However, it still…”
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Conference Proceeding -
18
Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14-09-2021)“…Quantum dot (QD) color-converted mini/micro-LED displays are considered as the most promising technology for next-generation display with the benefits of high…”
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Conference Proceeding -
19
Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer
Published in 2021 International Conference on Electronics Packaging (ICEP) (12-05-2021)“…Laser patterning of quantum dots color conversion (QDCC) layer has proven technically feasible to be implemented in full-color mini/micro-LED displays…”
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Conference Proceeding -
20
Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display
Published in 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (01-08-2020)“…The major hurdle to the implementation of full-color mini/micro-LED display is the mass transfer of red-green-blue (RGB) LED chips, which leads to low yield…”
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Conference Proceeding