Search Results - "LO, Jeffery C. C."

Refine Results
  1. 1

    Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing by Tu, Ning, Lo, Jeffery C C, Lee, S W Ricky

    Published in Polymers (16-01-2023)
    “…The inkjet printing method is a promising method to deposit polymer and functional nanoparticles at the microscale. It can be applied in the fabrication of…”
    Get full text
    Journal Article
  2. 2

    Characterization and Evaluation of 3D-Printed Connectors for Microfluidics by Xu, Qianwen, Lo, Jeffery, Lee, Shi-Wei

    Published in Micromachines (Basel) (26-07-2021)
    “…3D printing is regarded as a useful tool for the fabrication of microfluidic connectors to overcome the challenges of time consumption, clogging, poor…”
    Get full text
    Journal Article
  3. 3

    Lens Forming by Stack Dispensing for LED Wafer Level Packaging by Rong Zhang, Lee, Shi-Wei Ricky, Lo, Jeffery C. C.

    “…In this paper, a moldless stack dispensing method to form an light-emitting diode (LED) lens at the wafer level is presented. This method uses a dispensing…”
    Get full text
    Journal Article
  4. 4

    An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test by Fuliang Le, Lo, Jeffery C. C., Xing Qiu, Lee, Shi-Wei Ricky, Xing Li, Chi-Ying Tsui, Wing-Hung Ki

    “…Transcorneal electrical stimulation (TcES) is one of the potential therapies to prevent retinal degeneration. This study reports on an implantable medical…”
    Get full text
    Journal Article
  5. 5

    UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars by Qiu, Xing, Lo, Jeffery C. C., Cheng, Yuanjie, Lee, S. W. Ricky, Tseng, Yong Jhe, Yi, Hung Kuan, Chiu, Peter

    Published in Journal of microelectromechanical systems (01-12-2020)
    “…Ultraviolet (UV) assisted printing has emerged as a promising additive manufacturing (AM) technology, which puts UV light sources with focused emission in high…”
    Get full text
    Journal Article
  6. 6

    The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation by Shang, Andrew W., Lo, Jeffery C. C., Lee, S. W. Ricky

    “…While highly thermally conductive underfill material has been proposed as a solution for reducing the thermal resistance of flip-chip light-emitting diode…”
    Get full text
    Journal Article
  7. 7

    Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes by Shang, Andrew W., Lo, Jeffery C. C., Lee, Ricky S. W.

    “…Light-emitting diode (LED) devices depend strongly on proper thermal management to mitigate negative effects caused by high operating temperature, especially…”
    Get full text
    Journal Article
  8. 8

    A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer by Yao, Yuan, Qiu, Xing, Cheng, Yuanjie, LO, Jeffery C. C., Ricky Lee, S. W., Ki, Wing-Hung, Tsui, Chi-Ying

    Published in IEEE electron device letters (01-03-2023)
    “…The design of a thin-film spiral inductor with multi-fin structure on a flexible substrate is proposed that can be used in a fully integrated wireless power…”
    Get full text
    Journal Article
  9. 9

    Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing by Fuliang Le, Lee, Shi-Wei Ricky, Chaoran Yang, Lo, Jeffery C. C.

    “…This paper introduces a through-silicon-via (TSV) dispensing approach to accomplish the underfill process without a conventional reservoir. The vias function…”
    Get full text
    Journal Article
  10. 10

    Reliability study of surface mount printed circuit board assemblies with lead-free solder joints by Lo, Jeffery C.C, Jia, B.F, Liu, Z, Zhu, J, Ricky Lee, S.W

    Published in Soldering & surface mount technology (01-01-2008)
    “…Purpose - The purpose of this paper is to evaluate the lead-free solder joint reliability of a variety of surface mount components assembled onto printed…”
    Get full text
    Journal Article
  11. 11

    Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays by Xu, Qianwen, Lee, S. W. Ricky, Guo, Yusong, Lo, Jeffery C. C.

    “…Microfluidics has attracted significant attention for biological applications, particularly for high-throughput screening and multiplexing. However,…”
    Get full text
    Conference Proceeding
  12. 12

    Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints by Jiang, Qian, Tu, Ning, Lo, Jeffery C. C., Ricky Lee, S. W.

    “…Inkjet printing has been studied as one of the potential complements to conventional photolithography for low-cost and rapid prototyping. Different functional…”
    Get full text
    Conference Proceeding
  13. 13

    Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die Stacking by Xu, Hua, Lo, Jeffery C. C., Lee, S. W. Ricky

    “…Smaller thermal resistance between stacked chips will help reduce the junction temperature of 3D integrated circuit (3D-IC) under the same operating condition…”
    Get full text
    Conference Proceeding
  14. 14

    Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet by Lo, Jeffery C. C., Jiang, Qian, Qiu, Xing, Tu, Ning, Lee, S. W. Ricky

    “…Additive manufacturing has been extensively studied as a promising candidate for complete or partial replacement of traditional photolithography methods. The…”
    Get full text
    Conference Proceeding
  15. 15

    Inkjet Printing High Resolution Polydimethylsiloxane Dots Array by Tu, Ning, Lo, Jeffery C. C., Ricky Lee, S. W.

    “…Inkjet printing polydimethylsiloxane (PDMS) has gain attention in the development of quantum dots light emitting diodes (QLEDs), color conversion layers,…”
    Get full text
    Conference Proceeding
  16. 16

    A UVC LED Disinfection Closet for Reuse of Protective Coats by Qiu, Xing, Lo, Jeffery C. C., Cheng, Yuanjie, Xu, Hua, Xu, Qianwen, Lee, S. W. Ricky

    “…A closet featured with 1 minute disinfection time was developed for high efficient disinfection of protective coats. An ultraviolet-C light-emitting diode (UVC…”
    Get full text
    Conference Proceeding
  17. 17

    Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance by Cheng, Yuanjie, Lo, Jeffery C. C., Qiu, Xing, Xu, Hua, Tao, Mian, Lee, S. W. Ricky

    “…Quantum dot (QD) color conversion (QDCC) film with monochrome excitation backlight is a promising way to implement mini/micro-LED displays. However, it still…”
    Get full text
    Conference Proceeding
  18. 18

    Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays by Cheng, Yuanjie, Lo, Jeffery C. C., Qiu, Xing, Lee, S. W. Ricky

    “…Quantum dot (QD) color-converted mini/micro-LED displays are considered as the most promising technology for next-generation display with the benefits of high…”
    Get full text
    Conference Proceeding
  19. 19

    Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer by Cheng, Yuanjie, Lo, Jeffery C. C., Qiu, Xing, Ricky Lee, S. W.

    “…Laser patterning of quantum dots color conversion (QDCC) layer has proven technically feasible to be implemented in full-color mini/micro-LED displays…”
    Get full text
    Conference Proceeding
  20. 20

    Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display by Cheng, Yuanjie, Lo, Jeffery C. C., Qiu, Xing, Shieh, Brian, Ricky Lee, S. W.

    “…The major hurdle to the implementation of full-color mini/micro-LED display is the mass transfer of red-green-blue (RGB) LED chips, which leads to low yield…”
    Get full text
    Conference Proceeding