Search Results - "Kyung Woon Jang"
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1
Screen printable epoxy/BaTiO₃ embedded capacitor pastes with high dielectric constant for organic substrate applications
Published in Journal of applied polymer science (15-10-2008)“…In this article, embedded capacitor pastes (ECPs) with various BaTiO₃ (BTO) powder contents were formulated and screen-printed on PCBs to fabricate capacitors…”
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Journal Article -
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Effects of Anisotropic Conductive Film Viscosity on ACF Fillet Formation and Chip-On-Board Packages
Published in IEEE transactions on electronics packaging manufacturing (01-04-2009)“…In this paper, the effects of anisotropic conductive film (ACF) viscosity on ACF fillet formation and, ultimately, on the pressure cooker test (PCT)…”
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Journal Article -
3
Effects of Heating Rate on Material Properties of Anisotropic Conductive Film (ACF) and Thermal Cycling Reliability of ACF Flip Chip Assembly
Published in IEEE transactions on components and packaging technologies (01-06-2009)“…In this paper, the effects of heating rate during anisotropic conductive film (ACF) curing processes on ACF material properties such as thermomechanical and…”
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Journal Article -
4
Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-05-2011)“…In this paper, wafer-level packages (WLPs) using an anisotropic conductive adhesives (ACAs) solution have been newly developed for flip-chip interconnections…”
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Effects of Thermal Cycling on Material Properties of Nonconductive Pastes (NCPs) and the Relationship Between Material Properties and Warpage Behavior During Thermal Cycling
Published in IEEE transactions on components and packaging technologies (01-09-2008)“…In this paper, the effects of thermal cycling on material properties such as coefficient of thermal expansion (CTE), modulus, and glass transition temperature…”
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Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards
Published in IEEE transactions on components and packaging technologies (01-09-2007)“…Nonconductive films (NCFs) are one of the polymer interconnect materials for flip-chip interconnection. NCFs containing no conductive particles play several…”
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A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
Published in Microelectronics and reliability (01-06-2012)“…In this work, thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assemblies having various chip and substrate thicknesses for…”
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A Study on the Curing Properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01-05-2018)“…In this study, flip chip assembly using NCFs was evaluated in Sn-Ag solder bump structure. Thermo-Compression (TC) flip chip bonding was performed within 5…”
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Conference Proceeding -
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Ultrafast UV-Curable Adhesives for Optical Pick-Ups
Published in Journal of electronic materials (01-08-2013)“…This paper describes novel ultraviolet (UV)-curable adhesives with an ultrafast curing rate which are fully cured within 8 s for optical pick-up (OPU)…”
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Highly reliable non-conductive adhesives for flip chip CSP applications
Published in IEEE transactions on electronics packaging manufacturing (01-04-2003)“…Non-conductive adhesives (NCA), widely used in display packaging and fine pitch flip chip packaging technology, have been recommended as one of the most…”
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Journal Article -
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Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications
Published in Microelectronics and reliability (01-07-2008)“…In this paper, the material properties of anisotropic conductive films (ACFs) and ACF flip chip assembly reliability for a NAND flash memory application were…”
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Journal Article -
12
A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moiré Interferometry
Published in IEEE transactions on components and packaging technologies (01-03-2010)“…A primary factor of anisotropic conductive film (ACF) package failure is delamination between the chip and the adhesive at the edge of the chip. This…”
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Epoxy/BaTiO3 (SrTiO3) Composite Films and Pastes For High Dielectric Constant and Low Tolerance Embedded Capacitors in Organic Substrates
Published in 2006 1st Electronic Systemintegration Technology Conference (01-09-2006)“…Epoxy/BaTiO 3 composite embedded capacitor films (ECFs) were newly designed for high dielectric constant and low tolerance (less than plusmn5%) embedded…”
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Conference Proceeding
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Green manufacturing process for solder-less PCB assembly using uniform pressure surface interconnector and anisotropic conductive film
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01-05-2011)“…A new printed circuit board assembly (PBA) manufacturing process was invented and applied to replace conventional solder interconnection. For the realization…”
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Conference Proceeding -
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Effects of epoxy and rubber addition on die attach films (DAFs) materials properties
Published in 2009 59th Electronic Components and Technology Conference (01-05-2009)“…The trend for package miniaturization brings new packaging techniques such as 3-D stacking including stacking dies, packages, or modules. In 3-D stacking, die…”
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Conference Proceeding -
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Effects of Heating Rate During ACFs Curing Process on Material Properties and Thermal Cycling Reliability of Flip Chip Assembly
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01-05-2007)“…In this study, effects of heating rate during ACF curing processes on material properties such as thermo-mechanical properties and rheological properties of…”
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Conference Proceeding -
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Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections
Published in 2008 58th Electronic Components and Technology Conference (01-05-2008)“…In this study, wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections have been newly developed and…”
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Conference Proceeding -
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Reliability Evaluation for Flip-Chip Electronic Packages under High Temperature and Moisture Condition using Moiré
Published in 2008 10th Electronics Packaging Technology Conference (01-12-2008)“…The use of anisotropically conductive Film (ACF) for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging) offers…”
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Conference Proceeding -
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High reliable non-conductive adhesives for flip chip CSP applications
Published in 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) (2002)“…Chip Scale Packages (CSP) have been adapted for mobile phones, DVC, PC cards, PDA's and various other applications due to the robustness, cost effectiveness,…”
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Conference Proceeding -
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Effect of shield-can for drop/shock behavior of board level assembly
Published in 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01-06-2010)“…In order to protect electronic components on a Printed Circuit Board (PCB) against electromagnetic radiation/wave, a shielding in the form of an electrically…”
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Conference Proceeding