Search Results - "Kyong-Taek Lee"
-
1
Low-Frequency Noise After Channel Soft Oxide Breakdown in HfLaSiO Gate Dielectric
Published in IEEE electron device letters (01-05-2009)“…Low-frequency noise (LFN) after channel soft oxide breakdown (SBD) of n-MOSFETs with a HfLaSiO gate dielectric and TaN metal gate shows a Lorentzian-like…”
Get full text
Journal Article -
2
Technology scaling on High-K & Metal-Gate FinFET BTI reliability
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01-04-2013)“…High-K (HK) & Metal-Gate (MG) transistor technology have become a mainstream for the logic & SOC processes. On HK/MG process, bias-temp instability (BTI) poses…”
Get full text
Conference Proceeding -
3
Extraction of Effective Mobility from nMOSFETs With Leaky Gate Dielectric Using Time Domain Reflectometry
Published in IEEE transactions on electron devices (01-04-2015)“…The effective mobility (μ eff ) of MOSFETs with ultrathin high-k gate dielectric (EOT = 0.85 nm) has been successfully extracted using a time domain…”
Get full text
Journal Article -
4
PBTI-Associated High-Temperature Hot Carrier Degradation of nMOSFETs With Metal-Gate/High- k Dielectrics
Published in IEEE electron device letters (01-04-2008)“…Due to the increased physical dielectric thickness and reduced gate leakage in metal-gate/high-k devices, degradation caused by channel hot carriers (HCs)…”
Get full text
Journal Article -
5
RF and hot carrier effects in metal gate/high-k dielectric nMOSFETs at cryogenic temperature
Published in 2009 IEEE International Reliability Physics Symposium (01-04-2009)“…We investigate RF performances and hot carrier effects of nMOSFETs at cryogenic temperature. RF performances of HfO 2 dielectric nMOSFET at 77 K are improved…”
Get full text
Conference Proceeding -
6
Interfacial-Layer-Driven Dielectric Degradation and Breakdown of HfSiON/SiON Gate Dielectric nMOSFETs
Published in IEEE electron device letters (01-10-2011)“…This letter describes the dielectric degradation and breakdown characteristics of HfSiON/SiON gate dielectric nMOSFETs using the stress-induced leakage current…”
Get full text
Journal Article -
7
Reliability of HFO2/SIO2 dielectric with strain engineering using CESL stressor
Published in 2009 IEEE International Reliability Physics Symposium (01-04-2009)“…We have investigated reliability characteristics for a high-k/metal gate MOSFET with strain engineering under constant voltage stress (CVS). Using contact edge…”
Get full text
Conference Proceeding -
8
New observations on the random telegraph noise induced Vth variation in nano-scale MOSFETs
Published in 2014 IEEE International Reliability Physics Symposium (01-06-2014)“…In this paper, random telegraph noise (RTN) induced ΔV th variation under the worst bias condition is experimentally investigated. The results show that ΔV th…”
Get full text
Conference Proceeding -
9
Reliability study of methods to suppress boron transient enhanced diffusion in high-k/metal gate Si/SiGe channel pMOSFETs
Published in Microelectronic engineering (01-12-2013)“…The effects of extension profile engineering to suppress boron transient enhanced diffusion (TED) are investigated in Si/SiGe channel metal–oxide–semiconductor…”
Get full text
Journal Article -
10
A Study of Strain Engineering Using CESL Stressor on Reliability Comparing Effect of Intrinsic Mechanical Stress
Published in IEEE electron device letters (01-07-2009)“…The effects of a stressor nitride layer on device performance and reliability are investigated. To decouple intrinsic mechanical stress and process-related…”
Get full text
Journal Article -
11
Frequency dependent TDDB behaviors and its reliability qualification in 32nm high-k/metal gate CMOSFETs
Published in 2011 International Reliability Physics Symposium (01-04-2011)“…The TDDB failure mechanism of high-k dielectric/metal gate (HK/MG) CMOSFETs on DC and AC stress conditions are investigated in comparison to poly-Si/SiON. All…”
Get full text
Conference Proceeding -
12
A comparative study of depth profiling of interface states using charge pumping and low frequency noise measurement in SiO2/HfO2 gate stack nMOSFETs
Published in Microelectronic engineering (01-12-2011)Get full text
Conference Proceeding Journal Article -
13
Gate stack process optimization for TDDB improvement in 28nm high-k/metal gate nMOSFETs
Published in 2012 IEEE International Reliability Physics Symposium (IRPS) (01-04-2012)“…The effects of IL (interfacial layer) thickness and nitrogen concentration of high-k layer on TDDB are comprehensively investigated for HK/MG nMOSFETs…”
Get full text
Conference Proceeding -
14
The Effect of a Si Capping Layer on RF Characteristics of High- k /Metal Gate SiGe Channel pMOSFETs
Published in IEEE electron device letters (01-10-2010)“…We present a comparative study of the effects of a Si capping layer on SiGe channel pMOSFETs used for radio-frequency (RF) applications. In Si-capped devices,…”
Get full text
Journal Article -
15
Effect of Si capping layer on the interface quality and NBTI of high mobility channel Ge-on-Si pMOSFETs
Published in Microelectronic engineering (01-03-2009)“…The effects of a Si capping layer on the device characteristics and negative bias temperature instability (NBTI) reliability were investigated for Ge-on-Si…”
Get full text
Journal Article Conference Proceeding -
16
Effects of In Situ O2 Plasma Treatment on OFF-State Leakage and Reliability in Metal-Gate/High-k Dielectric MOSFETs
Published in IEEE electron device letters (01-06-2008)Get full text
Journal Article -
17
RF performance degradation in 100-nm metal gate/high-k dielectric nMOSFET by hot carrier effects
Published in 2009 Proceedings of the European Solid State Device Research Conference (01-09-2009)“…RF performances of 100-nm metal gate/high-k dielectric nMOSFET and parameters degradation by hot carrier injection to apply to RF integrated circuits are…”
Get full text
Conference Proceeding -
18
New observations on hot carrier induced dynamic variation in nano-scaled SiON/poly, HK/MG and FinFET devices based on on-the-fly HCI technique: The role of single trap induced degradation
Published in 2014 IEEE International Electron Devices Meeting (01-12-2014)“…In this paper, HCI induced dynamic variation in nano-scaled MOSFETs is systematically studied. Based on the proposed on-the-fly HCI technique, individual…”
Get full text
Conference Proceeding -
19
A comparative study of reliability and performance of strain engineering using CESL stressor and mechanical strain
Published in 2008 IEEE International Reliability Physics Symposium (01-04-2008)“…Effects of a stressor nitride layer on device performance and reliability are investigated. To decouple intrinsic mechanical stress and process-related…”
Get full text
Conference Proceeding -
20
Test Structures for Accurate UHF C-V Measurements of Nano-Scale CMOSFETs with HfSiON and TiN Metal Gate
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01-03-2007)“…Test structures for accurate UHF capacitance-voltage (C-V) measurements of high performance CMOSFETs with Hf-based high-k dielectric and TiN metal gate are…”
Get full text
Conference Proceeding