Search Results - "Kwon, Dukryel"
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Recrystallization by annealing on the copper films deposited by pulsed electroplating on the ECR plasma cleaned copper seed layer
Published in The 30th International Conference on Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts (2003)“…Summary form only given, as follows. Summary form only given. Cu seed layers deposited by magnetron sputtering onto the tantalum nitride barrier film were…”
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Conference Proceeding
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Electromigration resistance-related microstructural change with rapid thermal annealing of electroplated copper films
Published in Thin solid films (22-03-2005)“…Electromigration is now a primary concern regarding reliability of ultralarge scale integrated circuits (ULSI) because of increasing current density in…”
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Journal Article