Search Results - "Kutter, Christoph"
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1
Polyimide-Based Capacitive Humidity Sensor
Published in Sensors (Basel, Switzerland) (11-05-2018)“…The development of humidity sensors with simple transduction principles attracts considerable interest by both scientific researchers and industrial companies…”
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2
Air Leakages at Microvalves: Pressure Decay Measurements and Extended Continuum Modelling of Knudsen Flows
Published in Micromachines (Basel) (16-10-2024)“…To improve the performance of valves in relation to the leakage rate, a comprehensive evaluation of the valve characteristics and behavior during pressure…”
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3
The Combination of Micro Diaphragm Pumps and Flow Sensors for Single Stroke Based Liquid Flow Control
Published in Sensors (Basel, Switzerland) (03-04-2017)“…With the combination of micropumps and flow sensors, highly accurate and secure closed-loop controlled micro dosing systems for liquids are possible…”
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4
Minority Carrier Lifetime Measurements for Contactless Oxidation Process Characterization and Furnace Profiling
Published in Materials (08-01-2019)“…Contactless minority carrier lifetime (lifetime) measurements by means of microwave detected photoconductivity are employed for oxidation process…”
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5
Passivated Impedimetric Sensors for Immobilization-Free Pathogen Detection by Isothermal Amplification and Melt Curve Analysis
Published in Biosensors (Basel) (20-04-2022)“…The ongoing SARS-CoV-2 pandemic demonstrates that the capacity of centralized clinical diagnosis laboratories represents a significant limiting factor in the…”
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6
Low-Noise Si-JFETs Enhanced by Split-Channel Concept
Published in IEEE transactions on electron devices (01-11-2020)“…We present the results of low-noise silicon junction field-effect transistors (JFET) with a split-channel concept. The device can be manufactured as a module…”
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7
Towards fiber-reinforced front-sheets for lightweight PV modules in VIPV
Published in Solar energy materials and solar cells (15-10-2024)“…Novel approaches in the field of photovoltaics, such as building or vehicle integration require investigations of lightweight PV module concepts [1]. This…”
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8
Mechanical Robustness Analysis of Semiconductors with a Single Needle Probe Card Using Acoustic Emissions
Published in E-journal of Nondestructive Testing (01-10-2024)“…The combination of indentation testing and acoustic emission (AE) is widely used to analyze the fracture toughness of test substrates. In the manufacturing of…”
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9
Deposition of micro crystalline silicon films using microwave plasma enhanced chemical vapor deposition
Published in Thin solid films (01-01-2018)“…A microwave plasma enhanced chemical vapor deposition (microwave PECVD) process has been investigated to deposit micro crystalline silicon films with a high…”
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10
1.3 EU Ships Act Drives Pan-European Full-Stack Innovation Partnerships
Published in 2023 IEEE International Solid- State Circuits Conference (ISSCC) (19-02-2023)“…In every aspect of our life and society, semiconductors play a major role and that impact is set to increase even further. The pandemic in conjunction with…”
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Conference Proceeding -
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Low Profile Open MEMS and ASIC Packages manufactured by Flexible Hybrid Integration in a Roll-to-Roll compatible process
Published in 2018 48th European Solid-State Device Research Conference (ESSDERC) (01-09-2018)“…Here we report on a flexible, foil based packaging process in which a standard commercially available MEMS capacitive air pressure sensor is packaged in an…”
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Conference Proceeding -
12
Simple and Powerful encapsulation through Hybrid Packaging for Electrochemical Transducers
Published in 2021 Smart Systems Integration (SSI) (27-04-2021)“…We present a simple and reliable hybrid packaging of rigid electrochemical transducers and flexible foil having electrical connections. Among a large number of…”
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Conference Proceeding -
13
Design challenges for mobile communication devices
Published in ISLPED'06 Proceedings of the 2006 International Symposium on Low Power Electronics and Design (04-10-2006)“…System on Chips (SoC) for mobile devices, such as GSM/EDGE/UMTS, have strongly conflicting requirements. On one hand the demand for processing performance is…”
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Conference Proceeding -
14
Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates
Published in 2015 11th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) (01-06-2015)“…We report a Finite Element Model to calculate the bending stress of thin and ultra-thin silicon dies embedded in flexible foil substrates (chip-in-foil…”
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15
Design of an integrated piezoelectric micro-flapper based on bionic principles
Published in 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (01-05-2016)“…We present a novel micromachined piezoelectric actuator structure, which effects directed large area fluid transport on chip-level and is supposed to be used…”
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Electrical behaviour of Flip-Chip bonded thin silicon chip-on-foil assembly during bending
Published in 2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME) (01-10-2015)“…We present our results on the analysis of electrical performance of Flip-Chip bonded thin Silicon chip-on-foil assemblies during bending. A custom made bending…”
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Conference Proceeding