Search Results - "Kurosaka, Seigo"

Effects of Surface Treatment on Fatigue Property of A5052-H14 and A2017-T4 Aluminum Alloys by Kido, Ryota, Kuwano, Ryoichi, Hino, Makoto, Murayama, Keisuke, Kurosaka, Seigo, Oda, Yukinori, Horikawa, Keitaro, Kanadani, Teruto

“…In this study, the effect of anodization and electroless Ni–P plating on the fatigue strength of commercial A5052-H14 and A2017-T4 aluminum alloys was…”
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CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…One of the applications of wide band gap semiconductors is high temperature operation. That application requires high temperature compatible (i) joining…”
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Prominent interface structure and bonding material of power module for high temperature operation by Sugiura, Kazuhiko, Iwashige, Tomohito, Kawai, Jun, Tsuruta, Kazuhiro, Chuantong Chen, Nagao, Shijo, Hao Zhang, Sugahara, Tohru, Suganuma, Katsuaki, Kurosaka, Seigo, Sakuma, Yuichi, Oda, Yukinori

“…Sintered Ag is well known for die-attach materials, suitable for Ag metalized interfaces with a self-healing function of generated cracks. A remaining risk of…”
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Enhancement of bonding strength in Ag sinter joining on Au surface finished substrate by increasing Au grain-size by Zhang, Zheng, Chen, Chuantong, Liu, Guiming, Li, Caifu, Kurosaka, Seigo, Nagao, Shijo, Suganuma, Katsuaki

“…In this work, two methods were proposed to improve the bonding quality of Ag sinter joining on Au surface finished substrate (AgAu joint). The first method was…”
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Effects of Surface Treatment on Fatigue Property of A5052-H14 and A2017-T4 Aluminum Alloys by Kido, Ryota, Kuwano, Ryoichi, Hino, Makoto, Murayama, Keisuke, Kurosaka, Seigo, Oda, Yukinori, Horikawa, Keitaro, Kanadani, Teruto

“…In this study, the effect of anodization and electroless Ni–P plating on the fatigue strength of commercial A5052-H14 and A2017-T4 aluminum alloys was…”
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Effect of annealing Co-W-P metallization substrate onto its resin adhesion by Iwashige, Tomohito, Endo, Takeshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…The use of a Co-W-P metallization substrate in SiC power modules is expected to improve high temperature reliability because Co-W-P metallization has been…”
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Effect of Substrate Preheating Treatment on Thermal Reliability and Micro-Structure of Ag Paste Sintering on Au Surface Finish by Zhang, Zheng, Chen, Chuantong, Suganuma, Katsuaki, Kurosaka, Seigo

“…Sintering Ag paste on Au surface finished substrate (Ag-Au joint) is a hot topic due the Au surface finish is one of the mostly used surface methods in…”
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Barrier properties of electroless deposit of Co-W-P alloy by Kanzaki, Sho, Shibata, Toshiaki, Kurosaka, Seigo, Oda, Yukinori, Hashimoto, Shigeo

“…It is known that the Co alloy deposit has high electromigration resistance and thermal diffusion resistance to Cu. We could prepare electroless deposit of…”
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Improvement in bonding strength of Ag sinter joining on gold surface finished substrates by increasing the gold grain size by Zhang, Zheng, Chen, Chuangtong, Kurosaka, Seigo, Suganuma, Katsuaki

“…Realizing silver (Ag) sinter joining on gold surface finished substrates has attracted extensive attention because gold surfaces have superior performance and…”
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Metallization technology of SiC power module in high temperature operation by Iwashige, Tomohito, Sugiura, Kazuhiko, Endo, Takeshi, Tsuruta, Kazuhiko, Sakuma, Yuichi, Kurosaka, Seigo, Oda, Yukinori, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

“…We investigated a new metallization layer has both functions in high temperature reliability with Ag sinter joining and in high temperature adhesion with…”
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Thermostable electroless plating optimized for Ag sinter die-attach realizing high TJ device packaging by Hao Zhang, Nagao, Shijo, Kurosaka, Seigo, Fujita, Hiroshi, Yamamura, Keiji, Shimoyama, Akio, Seki, Shinya, Sugahara, Tohru, Suganuma, Katsuaki

“…In terms of die-attach for high T J device, metallization on the backside of the bare chip and the substrate surface affect the high-temperature reliability of…”
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