A 2.6-GByte/s multipurpose chip-to-chip interface
A 2.6 GByte/s megacell that interfaces to single or double byte wide DRAMs or logic chips is implemented using 0.35-0.18 /spl mu/m CMOS technologies. Special I/O circuits are used to guarantee 800 Mbit/s/pin data rate. Microwave PC board design methodologies are used to achieve the maximum possible...
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Published in: | IEEE journal of solid-state circuits Vol. 33; no. 11; pp. 1617 - 1626 |
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Main Authors: | , , , , , , , , , , , , , , , , , , , , , , , |
Format: | Journal Article |
Language: | English |
Published: |
IEEE
01-11-1998
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Subjects: | |
Online Access: | Get full text |
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Summary: | A 2.6 GByte/s megacell that interfaces to single or double byte wide DRAMs or logic chips is implemented using 0.35-0.18 /spl mu/m CMOS technologies. Special I/O circuits are used to guarantee 800 Mbit/s/pin data rate. Microwave PC board design methodologies are used to achieve the maximum possible interconnect bandwidth. |
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Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
ISSN: | 0018-9200 1558-173X |
DOI: | 10.1109/4.726545 |