A 2.6-GByte/s multipurpose chip-to-chip interface

A 2.6 GByte/s megacell that interfaces to single or double byte wide DRAMs or logic chips is implemented using 0.35-0.18 /spl mu/m CMOS technologies. Special I/O circuits are used to guarantee 800 Mbit/s/pin data rate. Microwave PC board design methodologies are used to achieve the maximum possible...

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Bibliographic Details
Published in:IEEE journal of solid-state circuits Vol. 33; no. 11; pp. 1617 - 1626
Main Authors: Lau, B., Yiu-Fai Chan, Moncayo, A., Ho, J., Allen, M., Salmon, J., Liu, J., Muthal, M., Lee, C., Nguyen, T., Horine, B., Leddige, M., Kuojim Huang, Wei, J., Leung Yu, Tarver, R., Yuwen Hsia, Vu, R., Tsern, F., Haw-Jyh Liaw, Hudson, J., Nguyen, D., Donnelly, K., Crisp, R.
Format: Journal Article
Language:English
Published: IEEE 01-11-1998
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Summary:A 2.6 GByte/s megacell that interfaces to single or double byte wide DRAMs or logic chips is implemented using 0.35-0.18 /spl mu/m CMOS technologies. Special I/O circuits are used to guarantee 800 Mbit/s/pin data rate. Microwave PC board design methodologies are used to achieve the maximum possible interconnect bandwidth.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0018-9200
1558-173X
DOI:10.1109/4.726545