Search Results - "Kumar, Nirajan"

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing by Civale, Yann, Croes, Kristof, Miyamori, Yuichi, Velenis, Dimitrios, Redolfi, Augusto, Thangaraju, Sarasvathi, Ammel, Annemie Van, Cherman, Vladimir, Plas, Geert Van der, Cockburn, Andrew, Gravey, Virginie, Kumar, Nirajan, Cao, Zhitao, Travaly, Youssef, Tőkei, Zsolt, Beyne, Eric, Swinnen, Bart

“…Barrier reliability in 3D through-Si via (TSV) Cu interconnections requires particular attention as these structures come very close to the active devices and…”
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Thermal stability of copper Through-Silicon Via barriers during IC processing by Civale, Y., Croes, K., Miyamori, Y., Thangaraju, S., Redolfi, A., Van Ammel, A., Velenis, D., Cherman, V., Hendrickx, P., Van der Plas, G., Cockburn, A., Gravey, V., Kumar, N., Zhitao Cao, Tezcan, D. S., Soussan, P., Travaly, Y., Tokei, Z., Beyne, E., Swinnen, B.

“…Barrier reliability in 3D Through-Si Via (TSV) Cu interconnections requires particular attention as these structures come very close to the active devices and…”
Get full text