Search Results - "Kumar, Mishra Dileep"

Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications by Kant Bajpai, Vishnu, Kumar Mishra, Dileep, Dixit, Pradeep

“…[Display omitted] •Fabrication of 3D microstructures in glass by lithography-free approach for RF MEMS.•Direct formation of through-holes and embedded…”
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Multi-Response Optimization during Electro-Discharge Machining of Super Alloy Inconel 718: Application of PCA-TOPSIS by Rahul, Srivastava, Ankur, Kumar Mishra, Dileep, Chatterjee, Suman, Datta, Saurav, Bhusan Biswal, Bibhuti, Sankar Mahapatra, Siba

“…The present work aims to determine an appropriate setting of process parameters (viz. gap voltage, peak discharge current, pulse-on time, duty factor and…”
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Fabrication of 3D microstructures in glass by direct writing electrochemical discharge machining by Mishra, Dileep Kumar, Dixit, Pradeep

“…The formation of 3D copper-filled microstructures in glass using direct writing electrochemical discharge machining (ECDM) and electrodeposition techniques is…”
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Experimental investigation into tool wear behaviour of line-array tool electrode during the electrochemical discharge micromilling process by Mishra, Dileep Kumar, Dixit, Pradeep

“…A tool-workpiece gap during the electrochemical discharge machining (ECDM) process is a critical parameter for successfully fabricating microchannels using…”
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Measurement and analysis of the geometric characteristics of microholes and tool wear for varying tool-workpiece gaps in electrochemical discharge drilling by Arab, Julfekar, Mishra, Dileep Kumar, Dixit, Pradeep

“…•The effect of the T-W gap on the microholes formation by the ECDD is reported.•A T-W gap of 10–30 µm for NaOH and 5–20 µm for KOH electrolyte must be…”
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Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding by Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Lianto, Prayudi, Chong, Ser Choong, Rao, Vempati Srinivasa

“…Hybrid bonding is one of the innovative permanent bonding technologies that form dielectric-dielectric and metal-metal bonds, respectively. Hybrid bonding is…”
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Cathode shape prediction for uniform electrochemical dissolution of array tools for ECDM applications by Mishra, Dileep Kumar, Singh, Tarlochan, Dixit, Pradeep

“…The effect of various cathode shapes, i.e., flat-plate, conical, and spherical-shaped cathodes, on the electrochemical dissolution (ECD) behavior of the 3 × 3…”
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Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications by Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa

“…The present study focuses on multi-chip stacked memory module development, and it encompasses a comprehensive overview of critical aspects, key learnings,…”
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Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking by Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Rao, B.S.S. Chandra, Choong Chong, Ser, Rao, Vempati Srinivasa

“…3D packaging with stacked dies is widely explored as a future advanced packaging technology for applications involving high-performance computing and High…”
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Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging by Arab, Julfekar, Mishra, Dileep Kumar, Kannojia, Harindra Kumar, Adhale, Pratik, Dixit, Pradeep

“…Formation of multiple through-holes arrays in a 400 μm thick silica substrate is reported for the first time by a cost-effective electrochemical discharge…”
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Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding by Chong, Ser Choong, Au Keng Yuen, Jason, Sekhar, Vasarla Nagendra, Cereno Daniel, Ismael, Kumar, Mishra Dileep, Srinivasa Rao, Vempati

“…Wafer to wafer hybrid bonding has been established to form fine pitch interconnections for high density I/O applications [1], [2]. However, this approach has…”
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Evaluation of Low Temperature Inorganic Dielectric Materials for Hybrid Bonding Applications by Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Choong, Chong Ser, Chandra Rao, B.S.S., Chui, King-Jien, Rao, Vempati Srinivasa

“…High-bandwidth memory (HBM) market is witnessing huge demand for high performance computing. Vertical/3D stacking of memory chips using hybrid bonding is a…”
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Polymer Dielectric Materials Evaluation for Hybrid Bonding Applications by Sekhar, Vasarla Nagendra, Fujiwara, Takenori, Araki, Hitoshi, Shoji, Yu, Jukei, Masaya, Nomura, Kota, Kumar, Mishra Dileep, Ser Choong, Chong, Rao, Vempati Srinivasa

“…Hybrid bonding is an emerging technology for advanced packaging and heterogeneous integration. In this work, Cu/polymer-based hybrid bonding is being evaluated…”
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Effect of pulse frequency and duty cycle on electrochemical dissolution behavior of multi-tip array tool electrode for reusability in the ECDM process by Singh, Tarlochan, Mishra, Dileep Kumar, Dixit, Pradeep

“…This article presents an experimental investigation to obtain the uniform tool tips of the worn tools’ after the electrochemical discharge machining (ECDM)…”
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Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding by Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa

“…Chip-to-wafer hybrid bonding is a promising packaging technology for bumpless and high-density interconnection. However, this approach presents numerous…”
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Effects of Tool Electrode on EDM Performance of Ti-6Al-4V by Rahul, Mishra, Dileep Kumar, Datta, Saurav, Masanta, Manoj

“…Due to widespread application of Ti-6Al-4V especially in automotive, aerospace, defense, and biomedical industries; machinability of this alloy is of immense…”
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Process Development and Integration on Si Substrate for Ion trap-based Quantum Processors by Li, H. Y., Liu Huihong, Clarence, Jaafar, Norhanani, Ahmadi, Morteza, Kumar, Mishra Dileep, Simonl, Goh Chun Kiat, YanYan, Zhou, Mukherjee, Manas, Jien, Chui King

“…Si substrates provide flexible platform for quantum application that can integrate photonic components, active devices, and metal electrodes. Photonics…”
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Investigations into surface topography of glass microfeatures formed by pulsed electrochemical discharge milling for microsystem applications by Verma, Aman Kumar, Mishra, Dileep Kumar, Pawar, Karan, Dixit, Pradeep

“…Experimental investigations into the effect of duty cycle and electrolyte concentration on the surface topography in the microchannel formation in the…”
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Numerical and experimental analysis of high-aspect-ratio micro-tool electrode fabrication using controlled electrochemical machining by Patro, Subrat Kumar, Mishra, Dileep Kumar, Arab, Julfekar, Dixit, Pradeep

“…Numerical and experimental analysis of high-aspect-ratio micro-tool electrodes fabrication using a controlled electrochemical machining (ECM) technique is…”
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Etching of micro-channels in fused quartz for novel device applications by Shetty, Shubhava, Kumar Mishra, Dileep, Dixit, Pradeep, Shetty, Shrushti S, Jayarama, A., shah, Amit P., gokhale, Mahesh R., Prabhu, Shriganesh, Duttagupta, S.P, Pinto, Richard

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