Simulations of magnetic domain patterns on the surface of Co/Ni multilayers

Magnetic domains in ultrathin films show a wide variety of patterns. Recent instrument developments, in particular in spin‐polarized low‐energy electron microscopy (SPLEEM), have allowed real‐time observation of magnetic domain patterns in thin films. Recent SPLEEM experiments have shown that the ma...

Full description

Saved in:

Bibliographic Details
Published in:	Surface and interface analysis Vol. 46; no. 12-13; pp. 1174 - 1177
Main Authors:	Kudo, Kauze, Suzuki, Masahiko, Kojima, Kazuki, Yasue, Tsuneo, Akutsu, Noriko, Kasai, Hideaki, Diño, Wilson Agerico, Bauer, Ernst, Koshikawa, Takanori
Format:	Journal Article
Language:	English
Published:	Bognor Regis Blackwell Publishing Ltd 01-12-2014 Wiley Subscription Services, Inc
Subjects:	Co/Ni multilayer Computer simulation Interface analysis Landau-Lifshitz-Gilbert equation magnetic anisotropy magnetic domain pattern Magnetic domains Multilayers Nickel Real time Simulation Thin films
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

Description
Summary:	Magnetic domains in ultrathin films show a wide variety of patterns. Recent instrument developments, in particular in spin‐polarized low‐energy electron microscopy (SPLEEM), have allowed real‐time observation of magnetic domain patterns in thin films. Recent SPLEEM experiments have shown that the magnetic anisotropy, and hence magnetic domain patterns, in a Co/Ni multilayer changes with the number of layers. We simulate the magnetic domain pattern formation on the surface of a Co/Ni multilayer. The numerical simulations well reproduce the magnetic domain patterns that were observed in the experiments. Copyright © 2014 John Wiley & Sons, Ltd.
Bibliography:	KAKENHI - No. 25400413 istex:7407367FF0DA53255DCC228DE705E16C6722FAC5 Grant-in-Aid for Scientific Research - No. 23246015 ArticleID:SIA5562 ark:/67375/WNG-25S4ZBKM-2 ObjectType-Article-1 SourceType-Scholarly Journals-1 ObjectType-Feature-2 content type line 23
ISSN:	0142-2421 1096-9918
DOI:	10.1002/sia.5562