Search Results - "Kuchenmeister, F"

Surface chemistry of planarized SiLK-films studied by XPS by HEEG, J, SCHUBERT, U, KÜCHENMEISTER, F

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Tolerance to mechanical damage in ten herbaceous grassland plant species by Breitsameter, L., Küchenmeister, K., Küchenmeister, F., Isselstein, J.

“…The establishment of plants with high damage tolerance may provide a means for soil protection on sites exposed to strong disturbance. In a pot experiment, we…”
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Transport of reactive metabolites of procarcinogens between different liver cell types, as demonstrated by the single cell microgel electrophoresis assay by Kuchenmeister, F., Wang, M., Klein, R.G., Schmezer, P.

“…Procarcinogens have to be activated by specific cytochromes before showing adverse effects. Freshly isolated hepatocytes (parenchymal liver cells, PC) are…”
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Systemic genotoxic effects of tobacco-related nitrosamines following oral and inhalational administration to Sprague-Dawley rats by Pool-Zobel, B L, Klein, R G, Liegibel, U M, Kuchenmeister, F, Weber, S, Schmezer, P

“…An ex vivo model to detect nonspecific DNA damage in different rat tissues has been developed and employed to study systemic properties of tobacco-specific…”
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In vivo studies on genotoxicity of pure and commercial linuron by Scassellati-Sforzolini, G, Pasquini, R, Moretti, M, Villarini, M, Fatigoni, C, Dolara, P, Monarca, S, Caderni, G, Kuchenmeister, F, Schmezer, P, Pool-Zobel, B.L

“…The ureic herbicide linuron [3-(3,4-dichlorophenyl)-1-methoxy-1-methylurea] (CAS 330-55-2) was investigated for genotoxicity in a series of in vivo…”
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SiLK dielectric planarization by chemical mechanical polishing by Küchenmeister, F, Schubert, U, Wenzel, C

“…As the feature size of integrated circuits is driven to smaller dimensions the importance of the inter- and intralayer isolator capacitance in future…”
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SiLK CMP process: interaction with slurries studied by surface characterization techniques by Kuchenmeister, F., Schubert, U., Heeg, J., Wenzel, C.

“…The integration of spin-on low dielectric constant materials within existing metallization schemes creates challenges for the material properties and…”
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Flexible polyimide interposer for CSP preparation by Beyer, V., Kuchenmeister, F., Bottcher, M., Meusel, E.

“…Chip size packaging (CSP) is a promising approach in packaging and interconnect technologies in order to solve the increasing demands in microelectronics and…”
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Film chip interconnect systems prepared by wet chemical metallization by Kuchenmeister, F., Bottcher, M., Beyer, V., Thierbach, S., Ekkehard, M., Agater, M., Kickelhain, J., Meier, D.

“…A novel low cost flip-chip like microelectronics packaging technology for bonding integrated circuits to polymer foils has been developed. The chip with the…”
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N-nitrososdimethylamine is activated in microsomes from hepatocytes to reactive metabolites which damage DNA of non-parenchymal cells in rat liver by Frei, Eva, Kuchenmeister, Frank, Gliniorz, Reinhard, Breuer, Andrea, Schmezer, Peter

“…The liver carcinogen N-nitrosodimethylamine (NDMA) has to be metabolically activated by specific cytochromes before it can react with cellular macromolecules…”
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Genotoxic bifunctional aldehydes produce specific images in the comet assay by Kuchenmeister, Frank, Schmezer, Peter, Engelhardt, Günter

“…Seven genotoxic aldehydes (acrolein, chloroacetaldehyde, crotonaldehyde, formaldehyde, glutardialdehyde, glyoxal, and methylacrolein) have been studied in…”
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SiLK dielectric planarization by chemical mechanical polishing by Kuchenmeister, F, Schubert, U, Wenzel, C

“…As the feature size of integrated circuits is driven to smaller dimensions the importance of the inter- and intralayer isolator capacitance in future…”
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Detection of genotoxic effects in human gastric and nasal mucosa cells isolated from biopsy samples by Pool-Zobel, B L, Lotzmann, N, Knoll, M, Kuchenmeister, F, Lambertz, R, Leucht, U, Schröder, H G, Schmezer, P

“…To assess genotoxic burdens from chemicals, it is necessary to relate observations in experimental animals to humans. The success of this extrapolation would…”
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Conductive polymers for microelectronic packaging: chip bonding to polymer films by Küchenmeister, Frank, Böttcher, Matthias, Meusel, Ekkehard, Meier, Dieter

“…A novel flipchip‐like microelectronic packaging technology for bonding integrated circuits to polymer foils using laser micromachining technique and a wet…”
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Genotoxic effect on human mucous membrane biopsies of the upper aerodigestive tract by Harréus, U, Schmezer, P, Kuchenmeister, F, Maier, H

“…In numerous epidemiologic studies, environmental and occupational substances such as sodium dichromate (Na2Cr2O7), benzo[a]pyren (B(a)P), and…”
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Human epithelial cells from the upper aerodigestive tract show different susceptibility to genotoxic carcinogens by Harréus, U., Schmezer, P., Maier, H., Kuchenmeister, F., Bartsch, H.

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CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing by Geisler, H., Lehr, M. U., Platz, A., Kuchenmeister, F., Mayer, U., Rossler, T., Paul, J., Lehmann, L., Hofmann, P., Engelmann, H.-J

“…Integration of compliant and brittle ultralow-k (ULK) interlayer dielectric (ILD) materials in advanced backend-of-line (BEOL) layer stacks requires a careful…”
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SiLK1 dielectric planarization by chemical mechanical polishing by KÜCHENMEISTER, F, SCHUBERT, U, WENZEL, C

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