Search Results - "Kuang Yeu Hsieh"
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1
Modeling the Impact of Random Grain Boundary Traps on the Electrical Behavior of Vertical Gate 3-D NAND Flash Memory Devices
Published in IEEE transactions on electron devices (01-06-2014)“…The 3-D stacking of multiple layers of NAND using thin-film transistor (TFT) devices is widely accepted as the next step in continuing NAND Flash scaling. Low…”
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Journal Article -
2
A Study of Gate-Sensing and Channel-Sensing (GSCS) Transient Analysis Method-Part I: Fundamental Theory and Applications to Study of the Trapped Charge Vertical Location and Capture Efficiency of SONOS-Type Devices
Published in IEEE transactions on electron devices (01-08-2008)“…Using a recently developed gate-sensing and channel- sensing (GSCS) transient analysis method, we have studied the detailed charge-trapping behavior for…”
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3
Ultra-High Bit Density 3D NAND Flash-Featuring-Assisted Gate Operation
Published in IEEE electron device letters (01-10-2015)“…Lower saturation current flowing through the same cell twice is a major drawback of vertical stack array transistor architecture. A loading effect further…”
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4
Physical Model of Field Enhancement and Edge Effects of FinFET Charge-Trapping NAND Flash Devices
Published in IEEE transactions on electron devices (01-06-2009)“…The physical model for field enhancement (FE) and the edge effects of body-tied FinFET charge-trapping NAND Flash devices are extensively studied in this…”
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Journal Article -
5
Studies of the reverse read method and second-bit effect of 2-bit/cell nitride-trapping device by quasi-two-dimensional model
Published in IEEE transactions on electron devices (01-01-2006)“…The reverse read method and second-bit effect of the 2-bit/cell nitride-trapping device are comprehensively studied by a quasi-two-dimensional (2-D) model…”
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6
A Study of Gate-Sensing and Channel-Sensing (GSCS) Transient Analysis Method Part II: Study of the Intra-Nitride Behaviors and Reliability of SONOS-Type Devices
Published in IEEE transactions on electron devices (01-08-2008)“…For the first time, we can directly investigate the charge transport and intra-nitride behaviors of SONOS-type devices by exploiting the gate-sensing and…”
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7
A highly scalable 8-layer 3D vertical-gate (VG) TFT NAND Flash using junction-free buried channel BE-SONOS device
Published in 2010 Symposium on VLSI Technology (01-06-2010)“…An 8-layer, 75 nm half-pitch, 3D stacked vertical-gate (VG) TFT BE-SONOS NAND Flash array is fabricated and characterized. We propose a buried-channel (n-type…”
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Conference Proceeding -
8
Study of the Band-to-Band Tunneling Hot-Electron (BBHE) Programming Characteristics of p-Channel Bandgap-Engineered SONOS (BE-SONOS)
Published in IEEE transactions on electron devices (01-04-2007)“…The band-to-band tunneling hot-electron (BBHE) programming characteristics of the 2 bit/cell p-channel bandgap-engineered…”
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Journal Article -
9
Modeling and Characterization of Hydrogen-Induced Charge Loss in Nitride-Trapping Memory
Published in IEEE transactions on electron devices (01-06-2007)“…This paper studies hydrogen diffusion in nitride-based Flash memory. Distorted capacitance-voltage ( C-V) curves were obtained when the programmed devices were…”
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Journal Article -
10
A High-Performance Body-Tied FinFET Bandgap Engineered SONOS (BE-SONOS) for nand-Type Flash Memory
Published in IEEE electron device letters (01-05-2007)“…A body-tied FinFET bandgap engineered (BE)-silicon-oxide-nitride-oxide-silicon (SONOS) nand Flash device is successfully demonstrated for the first time…”
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11
Future challenges of flash memory technologies
Published in Microelectronic engineering (01-03-2009)“…Flash memory application has seen explosive growth in recent years and this trend is likely to continue because new and more demanding applications are…”
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Journal Article Conference Proceeding -
12
A transient analysis method to characterize the trap vertical location in nitride-trapping devices
Published in IEEE electron device letters (01-12-2004)“…A new method to probe the trap vertical location for nitride-trapping devices is proposed. This method requires only measuring the time dependence of gate…”
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Journal Article -
13
Tungsten Oxide Resistive Memory Using Rapid Thermal Oxidation of Tungsten Plugs
Published in Japanese Journal of Applied Physics (01-04-2010)“…A complementary metal oxide semiconductor (CMOS)-compatible WO x based resistive memory has been developed. The WO x memory layer is made from rapid thermal…”
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Journal Article -
14
Study of the Erase Mechanism of MANOS ( \hbox\hbox/\hbox/\hbox) Device
Published in IEEE electron device letters (01-07-2007)“…The erase characteristics and mechanism of metal- Al 2 O 3 -nitride-oxide-silicon (MANOS) devices are extensively studied. We use transient analysis to…”
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Journal Article -
15
Pulse- IV Characterization of Charge-Transient Behavior of SONOS-Type Devices With or Without a Thin Tunnel Oxide
Published in IEEE electron device letters (01-04-2009)“…The transient behavior of SONOS-type devices was investigated for the first time using pulse- IV technique. Three kinds of SONOS devices are studied: SONS…”
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16
A novel 1T2R self-reference physically unclonable function suitable for advanced logic nodes for high security level applications
Published in Japanese Journal of Applied Physics (01-05-2022)“…A self-reference resistive random-access memory (ReRAM)-based one-transistor, two-ReRAM (1T2R) physically unclonable function (PUF) is proposed to provide a…”
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17
study of incremental step pulse programming (ISPP) and STI edge effect of BE-SONOS NAND Flash
Published in 2008 IEEE International Reliability Physics Symposium (01-04-2008)“…Incremental-step-pulse programming (ISPP) is a key enabler for achieving tight V T distribution for MLC NAND Flash. The ISPP characteristics for BE-SONOS NAND…”
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Conference Proceeding -
18
A high-efficiency, reliable multilevel hardware-accelerated annealer with in-memory spin coupling and complementary read algorithm
Published in Japanese Journal of Applied Physics (01-04-2023)“…We proposed an in-memory spin coupler based on the 55 nm NOR flash technology to tackle the combinatorial optimization problems. The high-density and…”
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Journal Article -
19
A novel tite buffered Cu-GeSbTe/SiO2 electrochemical resistive memory (ReRAM)
Published in 2010 Symposium on VLSI Technology (01-06-2010)“…A novel solid-electrolyte based electrochemical induced conductive bridge (CB) resistive memory (ReRAM) is fabricated and characterized. The new device…”
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Conference Proceeding -
20
Reliability Assessment for an In-3D-NAND Approximate Searching Solution
Published in 2024 IEEE International Reliability Physics Symposium (IRPS) (14-04-2024)“…The reliability issues of an In-3D-NAND approximate searching system for Hamming distance computing are evaluated and solved by optimized high VT level,…”
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Conference Proceeding