Search Results - "Ku, Jahum"

Gate leakage current reduction and improved reliability with an ultra-thin Ti layer for low-power applications by Park, Jungmin, Choi, Pyungho, Kim, Soonkon, Kang, Heesung, Ku, Jahum, Choi, Byoungdeog

“…•Physical vapor deposition method was used for metal gate deposition.•Physical and electrical properties of TiN were analyzed with various Ar/N2 ratios.•TiN…”
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Extreamly Advanced Cu Interconnect with Selective ALD Barrier for High Performance Logic Device by Jang, Junki, Park, Kyoungpil, Park, Chibeom, Yoo, Seungyong, Cha, Seungkeun, Nam, Kyounghee, Kim, Kihyun, Son, Jeongwook, Park, Eunyoung, Lee, Jaeho, Kim, Joosung, Lee, Miji, Yeo, Myungsoo, Jung, EunJi, Kim, Rak-Hwan, Park, Doohwan, Kim, Chin, Choi, Yunki, Ha, Taehong, Ahn, Jeonghoon, Ku, Jahum

“…In this paper, selective atomic layer deposition (ALD) TaN barrier process was described for advanced high performance logic device. Compared to conventional…”
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Galvanic Corrosion Effect of Co Liner on ALD TaN Barrier by Jang, Junki, Kim, Changhyun, Yoon, Youngsoo, Choi, Yunki, Kim, Hoon, Park, Jungil, Park, Jaehyeong, Kang, Minguk, Kim, Youngwoo, Jang, Seonguk, Ahn, Junghwan, Park, Eunyoung, Jeong, Wonmin, Kim, Jeongjae, Oh, Minhyuk, Han, Wonkyu, Shin, Dongwoo, Kim, Wookhwan, Yang, Jaeyoung, Park, Honglae, Kwon, Segab, Ahn, Jeonghoon, Ku, Jahum

“…This paper describes strong galvanic corrosion effect of Co liner on atomic layer deposition (ALD) TaN barrier during Cu CMP. Compared to Co liner on physical…”
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