Search Results - "Kruszka, Renata"
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In-situ thin film copper–copper thermocompression bonding for quantum cascade lasers
Published in Journal of materials science. Materials in electronics (01-06-2021)“…The choice of metals, bonding conditions and interface purity are critical parameters for the performance of metal–metal bonding quality for quantum cascade…”
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The interplay between damage- and chemical-induced isolation mechanism in Fe+-implanted AlGaN/GaN HEMT structures
Published in Materials science in semiconductor processing (01-06-2021)“…This work presents the development of Fe ion implantation processes for the fabrication of thermally stable isolation of AlGaN/GaN high electron mobility…”
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Ohmic contact formation to GaN by Si+ implantation doping: Retarding layer, implantation fluence, encapsulation, and activation annealing temperature studies
Published in Materials science in semiconductor processing (01-02-2021)“…The aspects of Si+ implantation for low resistivity ohmic contact formation to gallium nitride (GaN) with moderate annealing temperatures for dopant activation…”
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Fabrication of Ultralow‐Bevel Angle Mesa Structures for Vertical GaN Devices
Published in Physica status solidi. A, Applications and materials science (01-11-2024)“…Low‐angle bevel mesa structures are the key technological ideas needed to produce high‐quality vertical GaN devices. Nevertheless, the literature lacks…”
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Ohmic contact formation to GaN by Ge+ implantation doping: Implantation fluence and encapsulation layer studies
Published in Materials science in semiconductor processing (01-08-2022)“…This work investigates aspects of electrical doping of gallium nitride (GaN) by Ge+ ion implantation for low-resistivity ohmic contacts, with particular…”
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Selective etching of p-GaN over Al0.25Ga0.75N in Cl2/Ar/O2 ICP plasma for fabrication of normally-off GaN HEMTs
Published in Materials science in semiconductor processing (01-02-2021)“…The article presents the results of development of selective etching of p-GaN over Al0.25Ga0.75N in Cl2/Ar/O2 ICP plasma for fabrication of normally-off p-GaN…”
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Temperature-dependent electrical characterization of high-voltage AlGaN/GaN-on-Si HEMTs with Schottky and ohmic drain contacts
Published in Solid-state electronics (01-09-2015)“…[Display omitted] •We fabricated HV AlGaN/GaN-on-Si HEMTs with Schottky and ohmic drain electrodes.•We examine impact of temperature on the electrical…”
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Electrical isolation of GaAs and AlGaAs/GaAs Quantum Cascade Lasers by deep hydrogen implantation
Published in Materials science in semiconductor processing (01-02-2018)“…Ion implantation can be applied to form the electrical isolation in AlGaAs/GaAs Quantum Cascade Laser (QCL) instead of mesa etching. In this paper, we present…”
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Influence of capping SiO2 layer on stability of NiO thin film under thermal stress
Published in Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE) (01-05-2011)“…NiO thin films deposited by RF reactive magnetron sputtering at room temperature were characterized by low optical transmittance, high acceptors concentration…”
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