Direct fabrication of micro/nano fluidic channels by electron beam lithography

We utilize the strongly energy dependent electron penetration properties of the negative tone electron resist SU–8 for direct fabrication of micro/nano fluidic channels. Electron beam lithography is thereby applied in a two step process. First, the SU–8 is exposed down to the substrate forming suppo...

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Bibliographic Details
Published in:	Microelectronic engineering Vol. 86; no. 4; pp. 1314 - 1316
Main Authors:	Koller, Daniel M., Galler, Nicole, Ditlbacher, Harald, Hohenau, Andreas, Leitner, Alfred, Aussenegg, Franz R., Kren, Joachim R.
Format:	Journal Article Conference Proceeding
Language:	English
Published:	Amsterdam Elsevier B.V 01-04-2009 Elsevier
Subjects:	3D Mask fabrication Applied sciences e-beam lithography Electronics Exact sciences and technology Micro fluidic Micro fluidic channel Microelectronic fabrication (materials and surfaces technology) Nano fluidic Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices SU–8 Nano fluidic Micro fluidic channel 3D Mask fabrication e-beam lithography SU–8 Micro fluidic Microelectronic fabrication Electron beam lithography Manufacturing process SU-8 Negative resist
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Summary:	We utilize the strongly energy dependent electron penetration properties of the negative tone electron resist SU–8 for direct fabrication of micro/nano fluidic channels. Electron beam lithography is thereby applied in a two step process. First, the SU–8 is exposed down to the substrate forming supporting structures, a second exposure step with accordingly modified exposure parameters results in elevated structures. As we demonstrate, this process allows the fabrication of precisely aligned nanoscopic fluidic channels over lengths of several millimeters. In addition, an application as microscale shadow masks for evaporation based deposition processes is discussed.
ISSN:	0167-9317 1873-5568
DOI:	10.1016/j.mee.2008.11.025