Search Results - "Kreiser, U."

Challenges and current status in 300 mm rapid thermal processing by Glück, M, Lerch, W, Löffelmacher, D, Hauf, M, Kreiser, U

“…Rapid Thermal Processing (RTP) will be indispensable to meet the process requirements of future device and integrated circuit (IC) generations. The paper…”
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Transient thermal behavior in a new RTP chamber by Tillmann, A., Kreiser, U., Munzinger, P., Frigge, S., Buschbaum, S., Schmid, P., Loeffelmacher, D., Merkwitz, M., Theilig, T.

“…The transient thermal behavior of 200 and 300 mm wafers in a new rapid thermal processing (RTP) chamber is investigated. The AST3000 is a new RTP tool to meet…”
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