Search Results - "Kraatz, Matthias"

In-situ X-ray tomographic imaging and controlled steering of microcracks in 3D nanopatterned structures by Kutukova, Kristina, Gluch, Jürgen, Kraatz, Matthias, Clausner, André, Zschech, Ehrenfried

“…[Display omitted] •A novel technique to monitor and control the microcracking process in specially designed 3D nanopatterned structures in real time is…”
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Effect of Al Concentration on Ferroelectric Properties in HfAlOx‐Based Ferroelectric Tunnel Junction Devices for Neuroinspired Applications by Kim, Jihyung, Kim, Dahye, Min, Kyung Kyu, Kraatz, Matthias, Han, Taeyoung, Kim, Sungjun

“…Since HfOx‐based ferroelectric tunnel junctions (FTJs) are attractive compared to perovskite‐based FTJs and other emerging memory devices, they are being…”
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Effect of Al Concentration on Ferroelectric Properties in HfAlO x ‐Based Ferroelectric Tunnel Junction Devices for Neuroinspired Applications by Kim, Jihyung, Kim, Dahye, Min, Kyung Kyu, Kraatz, Matthias, Han, Taeyoung, Kim, Sungjun

“…Since HfO x ‐based ferroelectric tunnel junctions (FTJs) are attractive compared to perovskite‐based FTJs and other emerging memory devices, they are being…”
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Effect of Al Concentration on Ferroelectric Properties in HfAlOx‐Based Ferroelectric Tunnel Junction Devices for Neuroinspired Applications by Kim, Jihyung, Kim, Dahye, Min, Kyung Kyu, Kraatz, Matthias, Han, Taeyoung, Kim, Sungjun

“…Ferroelectric Tunnel Junction Devices In article number 2300080, Jihyung Kim, Dahye Kim, Sungjun Kim, and colleagues demonstrate synaptic functions with a CMOS…”
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Effect of Al Concentration on Ferroelectric Properties in HfAlO x ‐Based Ferroelectric Tunnel Junction Devices for Neuroinspired Applications by Kim, Jihyung, Kim, Dahye, Min, Kyung Kyu, Kraatz, Matthias, Han, Taeyoung, Kim, Sungjun

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A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions by Kraatz, Matthias, Gall, Martin, Zschech, Ehrenfried, Schmeisser, Dieter, Ho, Paul S.

“…[Display omitted] •A model in 2D for electromigration simulation and statistical analysis has been proposed.•The computation was carried out on a parallel…”
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Advanced Analysis and Monitoring of Failure Mechanisms in Microelectronics Metallization by Clausner, Andre, Kraatz, Matthias, Crocoll, Sonja, Schuchart, Marc, Hein, Verena

“…Metallization structures in microelectronic systems undergo various degradation processes. They can be caused by diffusion mechanisms induced by electrical…”
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Scaling effects on microstructure and reliability for Cu interconnects by Ho, Paul S., Zschech, Ehrenfried, Schmeisser, Dieter, Meyer, Moritz A., Huebner, Rene, Hauschildt, Meike, Zhang, Lijuan, Gall, Martin, Kraatz, Matthias

“…Continuous scaling of Cu interconnect structures can significantly impact reliability-limiting processes such as electromigration and stress-induced voiding…”
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Scaling effects on microstructure and reliability for Cu interconnects: Feature Articles on Materials for Information Technology by HO, Paul S, ZSCHECH, Ehrenfried, SCHMEISSER, Dieter, MEYER, Moritz A, HUEBNER, Rene, HAUSCHILDT, Meike, LIJUAN ZHANG, GALL, Martin, KRAATZ, Matthias

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Organic Phase Resistance to Dissolution of Polycyclic Aromatic Hydrocarbon Compounds by Ortiz, Enrique, Kraatz, Matthias, Luthy, Richard G

“…The dissolution of naphthalene, phenanthrene, and pyrene from viscous organic phases into water was studied in continuous-flow systems for time periods ranging…”
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Social Bots: Wegbereiter der Maschinokratie by Lucas Gasser, Matthias Kraatz

“…Der Einsatz von Social Bots ist den Parteien von Verfassungs wegen untersagt. Den Staat trifft eine Schutzpflicht zur Gewährleistung eines fairen…”
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Simulation of Electrical and Mechanical Properties of Air-Bridge Cu Interconnects by Hyun Park, Kraatz, M., Im, J., Kastenmeier, B., Ho, P.S.

“…Several air-bridge type Cu interconnects, with air-gaps in the metal line level or extending to the via level, were modeled to evaluate their electrical…”
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Reduction of the initial defect density and improvement of the reliabilityof Cu/low- k structures by a methylating treatment by Borthakur, Swarnal, Satyanarayana, Sri, Knorr, Andreas, Kraatz, Matthias, Ho, Paul S.

“…The reliability of Cu/low- k structures after a methylating treatment has been studied. The lifetime increases for structures that have undergone the treatment…”
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Reduction of the initial defect density and improvement of the reliability of Cu/low- k structures by a methylating treatment by Borthakur, Swarnal, Satyanarayana, Sri, Knorr, Andreas, Kraatz, Matthias, Ho, Paul S.

“…The reliability of Cu/low- k structures after a methylating treatment has been studied. The lifetime increases for structures that have undergone the treatment…”
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Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation by Zschech, E., Ho, P.S., Schmeisser, D., Meyer, M.A., Vairagar, A.V., Schneider, G., Hauschildt, M., Kraatz, M., Sukharev, V.

“…Statistical analysis of electromigration (EM) lifetimes of inlaid copper interconnects, in situ microscopy experiments at embedded inlaid copper interconnect…”
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