Search Results - "Krüger, Patrick"
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Obesity-Induced Cellular Senescence Drives Anxiety and Impairs Neurogenesis
Published in Cell metabolism (07-05-2019)“…Cellular senescence entails a stable cell-cycle arrest and a pro-inflammatory secretory phenotype, which contributes to aging and age-related diseases. Obesity…”
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Obesity-Induced Cellular Senescence Drives Anxiety and Impairs Neurogenesis
Published in Cell metabolism (07-05-2019)Get full text
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Australian Objects in the Religious Studies Collection at the University of Münster: The “Pater Worms Collection” as a Case of Inter-Religious Contact
Published in Entangled religions (17-05-2023)“…The paper discusses the Australian artefacts in the collection of the Institute for the Study of Religion at the University of Münster. The collection was…”
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Mitochondria-to-nucleus retrograde signaling drives formation of cytoplasmic chromatin and inflammation in senescence
Published in Genes & development (01-03-2020)“…Cellular senescence is a potent tumor suppressor mechanism but also contributes to aging and aging-related diseases. Senescence is characterized by a stable…”
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Whole‐body senescent cell clearance alleviates age‐related brain inflammation and cognitive impairment in mice
Published in Aging cell (01-02-2021)“…Cellular senescence is characterized by an irreversible cell cycle arrest and a pro‐inflammatory senescence‐associated secretory phenotype (SASP), which is a…”
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A Collective Die to Wafer Bonding Approach Based on Surface-Activated Aluminum-Aluminum Thermocompression Bonding
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-03-2024)“…This work presents a collective die to wafer (D2W) bonding concept based on surface-activated aluminum-aluminum (Al-Al) thermocompression bonding, which…”
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The Assembly Investigation of a Multichip to PCB Flip-Chip Package Using Cu Pillar Bumps
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01-09-2024)“…This article conducts a comprehensive investigation of the assembly technologies of a Cu pillar-based multichip flip-chip package with low-cost PCB substrates…”
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Equivariant and Steerable Neural Networks: A review with special emphasis on the symmetric group
Published 08-01-2023“…Convolutional neural networks revolutionized computer vision and natrual language processing. Their efficiency, as compared to fully connected neural networks,…”
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Development and Realization of Plasma Activated Low Temperature SiOx-SiOx Fusion Bonding Based on a Collective Die-to-Wafer Bonding Process
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11-09-2024)“…In this work a plasma activated low temperature SiO x -SiO x fusion bonding (PA-Fusion-Bonding) in a collective die to wafer bonding (CD2W-Bonding) approach is…”
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Conference Proceeding -
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Sub-THz Beam-Steering Antenna in Silicon Interposer Technology
Published in 2024 54th European Microwave Conference (EuMC) (24-09-2024)“…This paper presents the development of the first sub-THz frequency beam-steering antenna based on bipolar complementary metal oxide semiconductor (BiCMOS)…”
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Conference Proceeding -
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Fabrication and Implementation of BiCMOS BEOL Silicon Interposer Technologies with Integrated Metal Reflectors for Sub-THz Leaky-Wave Antennas
Published in 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) (11-09-2024)“…The fabrication and implementation of a 200 mm BiCMOS BEOL silicon interposer technology for sub-THz leaky-wave antennas is demonstrated. The BEOL silicon…”
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Conference Proceeding -
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Bond Strength Optimization of Plasma Activated Low Temperature Oxide-Oxide Fusion Bonding Through Thermocycling
Published in 2021 IEEE International 3D Systems Integration Conference (3DIC) (01-10-2021)“…In this work, the influence of annealing time and number of annealing steps on the shear strength of plasma activated low temperature oxide-oxide fusion…”
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Conference Proceeding -
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Preparation of Germanium-on-insulator (GOI) wafers by means of layer transfer tehnique
Published in 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (01-06-2020)“…In this work, transfer of the Ge layer on to a SiO2 layer to realize a Ge-on-Insulator (GOI) wafer is performed based on a wafer-level bonding process. The…”
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Conference Proceeding -
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Lifetime abstainers and mortality risk in the United States
Published in Vienna yearbook of population research (2014)Get full text
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