A microstructure for thermal conductivity measurement of conductive thin films

A microstructure for thermal conductivity measurement of conductive thin films

Thermal properties of thin film materials used in the microelectro mechanical systems (MEMS) industry can differ from bulk materials. It is of great importance for numerous MEMS applications to have a precise knowledge of the thermal properties as they can influence device’s final performance. We re...

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Bibliographic Details
Published in:Microelectronic engineering Vol. 88; no. 8; pp. 2408 - 2412
Main Authors: Thuau, D., Koymen, I., Cheung, R.
Format: Journal Article Conference Proceeding
Language:English
Published: Amsterdam Elsevier B.V 01-08-2011
Elsevier
Subjects:
Aluminum
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Conductive thin film
Design engineering
Electronics
Exact sciences and technology
Heat transfer
Indium tin oxide
Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties
MEMS
Micro- and nanoelectromechanical devices (mems/nems)
Microstructure
Physics
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)
Thermal conductivity
Thermal properties
Thermal properties of condensed matter
Thermal properties of small particles, nanocrystals, nanotubes
Thin films
Titanium
Thermal conductivity
MEMS
Conductive thin film
Microstructure
Performance evaluation
Thermal behavior
Doped materials
Aluminium
Indium oxide
Thin film
Thermal properties
Tin addition
Mechanical system
Titanium
Microelectromechanical device
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Summary:Thermal properties of thin film materials used in the microelectro mechanical systems (MEMS) industry can differ from bulk materials. It is of great importance for numerous MEMS applications to have a precise knowledge of the thermal properties as they can influence device’s final performance. We report on the design, the fabrication and the characterization of a MEMS structure for the measurement of thermal conductivity of conductive thin films. The thermal conductivity of titanium (Ti), indium tin oxide (ITO) and aluminum (Al) 500nm thin films has been investigated and found to be 16.8Wm−1K−1, 10.2Wm−1K−1 and 200Wm−1K−1, respectively, and are close to the thermal conductivity value of bulk materials.
Bibliography:ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2010.12.119