Search Results - "Kouassi, Sébastien"

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  1. 1

    Integration of porous silicon in microfuel cells: a review by Gautier, Gaël, Kouassi, Sebastien

    Published in International journal of energy research (01-01-2015)
    “…SUMMARY In this review, a particular emphasis is put on the integration of porous silicon in microfuel cells. After a general description of porous silicon…”
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    Journal Article
  2. 2

    Scalloping removal on DRIE via using low concentrated alkaline solutions at low temperature by Defforge, Thomas, Song, Xi, Gautier, Gaël, Tillocher, Thomas, Dussart, Rémi, Kouassi, Sébastien, Tran-Van, François

    Published in Sensors and actuators. A. Physical. (01-11-2011)
    “…The scalloping removal on the silicon via sidewalls after a Deep Reactive Ion Etching (DRIE) by the so-called STiGer process has been achieved using a low…”
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    Journal Article
  3. 3

    Proton exchange membrane micro fuel cells on 3D porous silicon gas diffusion layers by Kouassi, S., Gautier, G., Thery, J., Desplobain, S., Borella, M., Ventura, L., Laurent, J.-Y.

    Published in Journal of power sources (15-10-2012)
    “…Since the 90's, porous silicon has been studied and implemented in many devices, especially in MEMS technology. In this article, we present a new approach to…”
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    Journal Article
  4. 4

    Macroporous silicon hydrogen diffusion layers for micro-fuel cells: From planar to 3D structures by Gautier, G., Kouassi, S., Desplobain, S., Ventura, L.

    Published in Microelectronic engineering (01-02-2012)
    “…In this study, we demonstrate the possibility of using macroporous silicon as a hydrogen diffusion layer in integrated planar and 3D proton exchange membrane…”
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    Journal Article Conference Proceeding
  5. 5

    Enabling the Use of High Precision Glass Wafers in a Conventional Si Fab by Zhang, Jay, Ng, Chee-Hau, Kouassi, Sebastien

    “…Glass has unique properties that make it attractive for many applications. Combining glass with Si fabrication process would create new possibilities not only…”
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    Journal Article
  6. 6

    Deep trench etching combining aluminum thermomigration and electrochemical silicon dissolution by Gautier, G., Ventura, L., Jérisian, R., Kouassi, S., Leborgne, C., Morillon, B., Roy, M.

    Published in Applied physics letters (22-05-2006)
    “…A micromachining technique for silicon deep anisotropic etching and isolating porous silicon structures is developed. This original method combines aluminum…”
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    Journal Article
  7. 7