Search Results - "Kotschenreuther, J."

The manufacturing of micro molds by conventional and energy-assisted processes by Fleischer, J., Kotschenreuther, J.

“…The miniaturization of parts and components plays an important role in today’s economy, enabling the design and production of new and highly sophisticated…”
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INFLUENCE OF FRICTION AND PROCESS PARAMETERS ON THE SPECIFIC CUTTING FORCE AND SURFACE CHARACTERISTICS IN MICRO CUTTING by Weber, M., Autenrieth, H., Kotschenreuther, J., Gumbsch, P., Schulze, V., Löhe, D., Fleischer, J.

“…For the production of small quantities of micro devices, machining is a low cost alternative to lithographic processing techniques. However, machining shows…”
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INVESTIGATION OF SIZE-EFFECTS IN MACHINING WITH GEOMETRICALLY DEFINED CUTTING EDGES by Weber, M., Hochrainer, T., Gumbsch, P., Autenrieth, H., Delonnoy, L., Schulze, V., Löhe, D., Kotschenreuther, J., Fleischer, J.

“…The miniaturization of cutting processes shows process specific size-effects like the exponential increase of the specific cutting force k c with decreasing…”
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Mechanical structuring, surface treatment and tribological characterization of steel mould inserts for micro powder injection moulding by Schneider, J., Kienzler, A., Deuchert, M., Schulze, V., Kotschenreuther, J., Zum Gahr, K.-H., Löhe, D., Fleischer, J.

“…Manufacturing of ceramic and metallic micro components in micro powder injection moulding (μPIM) requires mould inserts offering high wear resistance and a…”
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Extension of cutting force formulae for microcutting by Fleischer, J., Schulze, V., Kotschenreuther, J.

“…During scaling of cutting processes size-effects occur due to not similarly scalable input parameters, e.g. ratio of cutting edge radius to depth of cut. These…”
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Net Shape Reaction Bonded Ceramic Micro Parts by Mechanical Microstructuring by Ritzhaupt-Kleissl, H.-J., Binder, J. R., Gietzelt, T., Kotschenreuther, J.

“…Net shape ceramic micro components can be realized by mechanical microstructuring green blanks consisting of precursor materials followed by reaction bonding…”
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