Search Results - "Kotadia, Hiren R"

Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging by Bhogaraju, Sri Krishna, Conti, Fosca, Kotadia, Hiren R., Keim, Simon, Tetzlaff, Ulrich, Elger, Gordon

“…Copper pastes suitable for low temperature and low pressure die-attach bonding were developed to enable sintering at 275 °C under N2 atmosphere. First, brass…”
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On the Prediction of Grain Refinement Mechanism in Direct Chill Casting of Aluminum and Its Alloys Under Low Degree Mechanical Forced Convection by Patel, Deepak, Biswas, Prasenjit, Kumar, Anil, Kotadia, Hiren R., Mallik, Archana, Das, Sanjeev

“…The present investigation focuses on grain refinement in pure aluminum and its alloy under mechanical stirring with a very low degree of forced convection of…”
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Challenges and Opportunities in Remote Laser Welding of Steel to Aluminium by Kotadia, Hiren R., Franciosa, Pasquale, Ceglarek, Dariusz

“…In the last two decades, the automotive industry has been facing demands to reduce fuel consumption and to meet CO 2 emissions through applications of…”
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A review: On the development of low melting temperature Pb-free solders by Kotadia, Hiren R., Howes, Philip D., Mannan, Samjid H.

“…Pb-based solders have been the cornerstone technology of electronic interconnections for many decades. However, with legislation in the European Union and…”
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Additive manufacturing of aluminium alloy 2024 by laser powder bed fusion: microstructural evolution, defects and mechanical properties by Kumar, Manoj, Gibbons, Gregory J, Das, Amitabha, Manna, Indranil, Tanner, David, Kotadia, Hiren R

“…Purpose The purpose of this study is to investigate the microstructural evolution of high-strength 2024 Al alloy prepared by the laser powder bed fusion…”
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An investigation into the use of incoherent UV light to augment IR nanosecond pulsed laser texturing of CFRP composites for improved adhesion by Al-Mahdy, Ahmed, Ahuir-Torres, Juan Ignacio, Öpöz, Tahsin T, Kotadia, Hiren R, Mullett, Jack, Sharp, Martin C

“…•Incoherent UV light treatment significantly enhances CFRP bonding strength.•UV treatment yields 10% higher bonding strength than laser-texturing.•The adhesion…”
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Scan strategy induced microstructure and consolidation variation in the laser-powder bed fusion (L-PBF) additive manufacturing of low alloy 20MnCr5 steel by Yang, Xinliang, Gibbons, Gregory J., Tanner, David A., Li, Zushu, Wilson, Paul, Williams, Mark A., Kotadia, Hiren R.

“…[Display omitted] •Scanning strategy plays a crucial role in influencing the porosity of the low alloy 20MnCr5 steel.•Thermal profile analysis for the…”
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Comparison of Formability and Microstructural Evolution of C106 Copper and 316L Stainless Steel by Taylor, Scott, Masters, Iain, Li, Zushu, Kotadia, Hiren R.

“…Strain-hardenable materials achieve their strength due to the build-up of defects and dislocation tangles within the microstructure brought about by strain…”
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Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging by Bhogaraju, Sri Krishna, R. Kotadia, Hiren, Conti, Fosca, Mauser, Armin, Rubenbauer, Thomas, Bruetting, Robert, Schneider-Ramelow, Martin, Elger, Gordon

“…Sinter pastes for rapid and low-temperature die-attach bonding are developed to enable sintering under a nitrogen atmosphere. First, microscale brass metal…”
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Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders by Mokhtari, Omid, Roshanghias, Ali, Ashayer, Roya, Kotadia, Hiren R., Khomamizadeh, Farzad, Kokabi, Amir H., Clode, Michael P., Miodownik, Mark, Mannan, Samjid H.

“…The use of nanoparticles to control grain size and mechanical properties of solder alloys at high homologous temperature is explored. It is found that silica…”
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Electronics Assembly and High Temperature Reliability Using Sn-3.8Ag-0.7Cu Solder Paste With Zn Additives by Kotadia, Hiren R., Panneerselvam, Arunkumar, Sugden, Mark W., Steen, Hector, Green, Mark, Mannan, Samjid H.

“…In this paper, we report a comparison of interfacial reactions of Sn-3.8Ag-0.7Cu (SAC 387) and SAC (0-1.5 Zn) solder pastes on Cu (organic solderability…”
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Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application by Ahuir-Torres, Juan Ignacio, Bhogaraju, Sri Krishna, West, Geoff, Elger, Gordon, Kotadia, Hiren R.

“…There has been a significant rise in interest from academic and industry communities on copper nano-and micro-particles-based sinter pastes for harsh…”
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Microstructural evolution of 316L austenitic stainless steel during in-situ biaxial deformation and annealing by Taylor, Scott, Kotadia, Hiren R.

“…Austenitic stainless steel 316L was investigated by a combination of in-situ biaxial straining and subsequently by in-situ annealing within a Carl Zeiss Sigma…”
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Low temperature and low pressure die-attach bonding of high power light emitting diodes with self reducing copper complex paste by Bhogaraju, Sri Krishna, Schmid, Maximilian, Hufnagel, Elias, Conti, Fosca, Kotadia, Hiren R, Elger, Gordon

“…The automotive high power light emitting diode (LED) market is expected to grow to ∼ US 30 billion by 2024 [1] and new interconnect technologies that enable…”
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Understanding the corrosion behaviour of Al-Mg alloy fabricated using a Laser Powder Bed Fusion (L-PBF) Additive Manufacturing (AM) process by Ahuir-Torres, Juan Ignacio, Gibbons, Gregory J., West, Geoff, Das, Amit, Kotadia, Hiren R.

“…Metal additive manufacturing (AM) is an emerging disruptive technology capable of manufacturing complex shaped components that are difficult to manufacture…”
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Corrosion behaviour of SiC particulate reinforced AZ31 magnesium matrix composite in 3.5 % NaCl with and without heat treatment by Ignacio Ahuir-Torres, Juan, Yang, Xinliang, West, Geoff, Kotadia, Hiren R.

“…Magnesium is a lightweight structural material widely utilised in automotive applications. To enhance its mechanical properties, ceramic particulate…”
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Design and manufacturing of a novel continuous casting technique for the addition of ceramic particulate reinforcement, alloying elements and grain refiners in Al-system by Biswas, Prasenjit, Kundu, Amrik, Kotadia, Hiren R., Mallik, Archana, Das, Sanjeev

“…Processing of aluminium and its alloy in an economical way is still a big challenge for the industry. In the present work, a novel continuous casting set-up…”
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A study on interfacial activities between Nb and liquid Al in static and dynamic condition by Biswas, Prasenjit, Patel, Deepak, Kumar, Anil, Bagani, Aaryan, Soni, Pranjal, Kotadia, R. Hiren, Das, Sanjeev

“…In the present study, an effort has been made to investigate the interfacial activities between the solid Niobium and liquid Aluminium. Aluminium was melted at…”
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Highly reliable die-attach bonding with etched brass flakes by Bhogaraju, Sri Krishna, Schmid, Maximilian, Kotadia, Hiren R, Conti, Fosca, Elger, Gordon

“…Highly reliable microparticle sinter paste based on etched brass flakes is developed. A low temperature (275^{\circ}\mathrm{C}), low pressure (10 MPa) and fast…”
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Limitations of nanoparticle enhanced solder pastes for electronics assembly by Kotadia, H. R., Panneerselvam, A., Green, M. A., Mannan, S. H.

“…This paper reviews the limitations discovered recently in using nanoparticles to enhance solder pastes and discusses possible solutions to these problems. The…”
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