Search Results - "Kong, C.J."
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The microstructures of a thermally sprayed and heat treated Al–20 wt.%Sn–3 wt.%Si alloy
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25-08-2005)“…High velocity oxy-fuel thermal spraying has been used to produce deposits of an Al–20 wt.%Sn–3 wt.%Si alloy approximately 300 μm thick on a steel substrate…”
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Welding with high power fiber lasers – A preliminary study
Published in Materials in engineering (2007)“…The new generation of high power fiber lasers presents several benefits for industrial purposes, namely high power with low beam divergence, flexible beam…”
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Analysis of microstructure formation in gas-atomised Al–12 wt.% Sn–1 wt.% Cu alloy powder
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25-04-2007)“…The microstructure of gas-atomised Al–12 wt.% Sn–1 wt.% Cu alloy powder has been investigated using scanning and transmission electron microscopy. Powder…”
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TEM assessment of HVOLF thermally sprayed Al–12 wt.% Sn–1 wt.% Cu alloy
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (15-07-2004)“…The high velocity oxy-liquid fuel (HVOLF) thermal spray technique has the potential to fabricate thick layers based on the Al–12wt.% Sn–1wt.% Cu alloy. The…”
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Electrical Characteristics of Near-Interface Traps in 3C-SiC Metal-Oxide-Semiconductor Capacitors
Published in IEEE electron device letters (01-09-2008)“…Deep-depletion capacitance measurements on n-type 3C-SiC MOS capacitors that exhibit both field and temperature dependencies are presented and analyzed in this…”
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Simulation of interface states effect on the scanning capacitance microscopy measurement of p–n junctions
Published in Applied physics letters (23-12-2002)“…A two-dimensional numerical simulation model of interface states in scanning capacitance microscopy (SCM) measurements of p–n junctions is presented. In the…”
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Extraction of MOSFET threshold voltage, series resistance, effective channel length, and inversion layer mobility from small-signal channel conductance measurement
Published in IEEE transactions on electron devices (01-12-2001)“…This paper proposes and demonstrates the extraction of MOSFET threshold voltage, source-drain resistance, gate field mobility reduction factor, and transistor…”
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