Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization

Influence of Alloying Elements on the Mechanical Properties of Anodized Aluminum and on the Adhesion of Copper Metallization

The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution...

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Bibliographic Details
Published in:Materials Vol. 14; no. 22; p. 7028
Main Authors: Medvedev, Oleg S., Alyasova, Ekaterina E., Besprozvannaya, Rona E., Gadzhiev, Asadula A., Krivova, Veronika V., Kondratev, Andrey S., Kim, Artem E., Novikov, Pavel A., Popovich, Anatoliy A.
Format: Journal Article
Language:English
Published: Basel MDPI AG 19-11-2021
MDPI
Subjects:
Adhesion
Adhesives
Alloying elements
Alloys
Aluminum alloys
Aluminum base alloys
Aluminum oxide
anodic aluminum oxide
Anodizing
Ceramics
Chemical elements
Copper
Electric vehicles
Experiments
Hardness
Heat conductivity
insulated metal substrate
Manufacturers
Mechanical properties
Metallizing
Modules
Morphology
Peel tests
Polymerization
Pricing
Substrates
Surface hardness
Thermal cycling
Topology
Transistors
Trends
Russia
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Summary:The active development of the power electronics market and a constant increase in the prices of components require new materials and approaches, including a power module packaging technology. The use of aluminum instead of copper in the power module baseplate is an interesting and promising solution. The insulated metal baseplate is one of the most extensively developed technologies nowadays. The object of this study is an insulated metal substrate based on anodized aluminum. The main goal of the article is the comparison of copper topology adhesion to an anodized aluminum oxide layer formed on different aluminum alloys with aluminum content of at least 99.3 wt %. Peel test and pull-off adhesions showed a twofold difference for both aluminum alloys. The high ordered defect-free anodized alumina formed on alloys with copper content of 0.06 wt % had a mean pull-off adhesion of 27 N/mm2 and hardness of 489 HV. In the case of the alloy with copper content of around 0.15 wt %, it had hardness of 295 HV and a mean pull-off adhesion of 12 N/mm2. The results of our microstructure investigation showed that anodized alumina based on alloys with copper content of around 0.15 wt % is fragile due to spherical holes. Summing up the results, it can be concluded that not all initial impurities are critical for anodized alumina, but some, specifically copper, dramatically decreased the mechanical properties of anodized alumina.
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ISSN:1996-1944
1996-1944
DOI:10.3390/ma14227028