3DIC Design Challenges, Early Solutions and Future Recommendations

This paper introduces unique aspects of 3D SoC design and presents key challenges faced by 3DIC design teams. An overview of a proposed innovative 3DIC design eco-system for efficient 3DIC early prototyping, implementation, and analysis is presented, followed by a description of specific modules of...

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Bibliographic Details
Published in:	2021 IEEE Custom Integrated Circuits Conference (CICC) pp. 1 - 4
Main Authors:	Kolesov, Victoria, Rajan, Vivek, Nagisetty, Ramune
Format:	Conference Proceeding
Language:	English
Published:	IEEE 01-04-2021
Subjects:	Application specific integrated circuits Conferences Ecosystems Three-dimensional displays
Online Access:	Get full text
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Summary:	This paper introduces unique aspects of 3D SoC design and presents key challenges faced by 3DIC design teams. An overview of a proposed innovative 3DIC design eco-system for efficient 3DIC early prototyping, implementation, and analysis is presented, followed by a description of specific modules of the 3DIC design eco-system. Features required in each of the modules, and their availability from the EDA tool vendors is presented. The application of the proposed 3DIC design ecosystem to a specific project highlights the efficacy of the 3DIC design framework. Based on the experience of this work, several necessary enhancements had been identified, which are the key for future 3DIC design enablement and efficiency.
ISSN:	2152-3630
DOI:	10.1109/CICC51472.2021.9431513