Search Results - "Kokkoris, G"

Multiscale Modeling in Chemical Vapor Deposition Processes: Models and Methodologies by Cheimarios, N., Kokkoris, G., Boudouvis, A. G.

“…Chemical vapor deposition (CVD) is an established process for the production of thin solid films for industrial and scientific applications for more than…”
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Lab-on-Chip platform and protocol for rapid foodborne pathogen detection comprising on-chip cell capture, lysis, DNA amplification and surface-acoustic-wave detection by Tsougeni, K., Kaprou, G., Loukas, C.M., Papadakis, G., Hamiot, A., Eck, M., Rabus, D., Kokkoris, G., Chatzandroulis, S., Papadopoulos, V., Dupuy, B., Jobst, G., Gizeli, E., Tserepi, A., Gogolides, E.

“…An advanced LoC system for bacteria capture, lysis, LAMP amplification, and label-free detection with a Surface Acoustic Wave (SAW) biosensor, including a…”
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A modified phase-field method for the investigation of wetting transitions of droplets on patterned surfaces by Pashos, G., Kokkoris, G., Boudouvis, A.G.

“…A variant of the phase-field method, suitably modified to enable equilibrium (static) computations, is proposed for the calculations of the equilibrium wetting…”
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Beware of symmetry breaking and periodic flow regimes in axisymmetric CVD reactor setups by Cheimarios, N., Kavousanakis, M., Kokkoris, G., Boudouvis, A.G.

“…•3D, nonlinear analysis of the solution space of an axisymmetric CVD reactor.•Buoyancy gives way to multiple solutions and symmetry-breaking.•Forced, free,…”
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Droplet Mobility Manipulation on Porous Media Using Backpressure by Vourdas, N, Pashos, G, Kokkoris, G, Boudouvis, A. G, Stathopoulos, V. N

“…Wetting phenomena on hydrophobic surfaces are strongly related to the volume and pressure of gas pockets residing at the solid–liquid interface. In this study,…”
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A passive micromixer for enzymatic digestion of DNA by Papadopoulos, V.E., Kefala, I.N., Kaprou, G., Kokkoris, G., Moschou, D., Papadakis, G., Gizeli, E., Tserepi, A.

“…•A passive micromixer with zigzag geometry is fabricated using FPC technology.•The total length of the micromixer is estimated by simulation.•The micromixer is…”
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Plasma Nanotextured Polymeric Surfaces for Controlling Cell Attachment and Proliferation: A Short Review by Tserepi, A., Gogolides, E., Bourkoula, A., Kanioura, A., Kokkoris, G., Petrou, P. S., Kakabakos, S. E.

“…Plasma etching has evolved in an important technology for rapid and cost-effective generation of random or quasi-ordered nanostructures in large areas and in a…”
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Optimization of Patterned Surfaces for Improved Superhydrophobicity through Cost-Effective Large-Scale Computations by Krokos, V, Pashos, G, Spyropoulos, A. N, Kokkoris, G, Papathanasiou, A. G, Boudouvis, A. G

“…The pattern design of superhydrophobic surfaces can be significantly aided by computations that predict the Cassie–Baxter (CB) to Wenzel (W) transition, which…”
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Dual nanoscale roughness on plasma-etched Si surfaces: Role of etch inhibitors by Kokkoris, G., Constantoudis, V., Angelikopoulos, P., Boulousis, G., Gogolides, E.

“…The nanoroughness formation and evolution during fluorine-based plasma etching of Si surfaces is investigated both experimentally and theoretically. Dual…”
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Plug actuation and active manipulation in closed monolithic fluidics using backpressure by Vourdas, N., Pashos, G., Rizos, E., Kokkoris, G., Tsampasis, E., Klouvidaki, E., Boudouvis, A.G., Stathopoulos, V.N.

“…We explore the mechanisms to actuate and manipulate liquid plugs in monolithic closed channel fluidics with porous hydrophobic walls. Applying a small…”
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An efficient parallel iteration method for multiscale analysis of chemical vapor deposition processes by Cheimarios, N., Kokkoris, G., Boudouvis, A.G.

“…A fixed point type iteration method is applied for coupling multiple length scales in Chemical Vapor Deposition (CVD) processes. A Reactor Scale Model (RSM),…”
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A multi-parallel multiscale computational framework for chemical vapor deposition processes by Cheimarios, N., Kokkoris, G., Boudouvis, A.G.

“…•A multiscale computational framework couples reactor (macro-) scale with feature (micro-) scale models in chemical vapor deposition processes.•A domain…”
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Multiscale Modeling in Chemical Vapor Deposition Processes: Models and Methodologies by Cheimarios, N., Kokkoris, G., Boudouvis, A. G.

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Nanoscale Roughness Effects at the Interface of Lithography and Plasma Etching: Modeling of Line-Edge-Roughness Transfer During Plasma Etching by Kokkoris, G., Constantoudis, V., Gogolides, E.

“…We present 3-D modeling results on resist line-edge-roughness (LER) transfer to underlying films during plasma etching. After generating random fractal resist…”
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Simulation of SiO2 and Si feature etching for microelectronics and microelectromechanical systems fabrication: A combined simulator coupling modules of surface etching, local flux calculation, and profile evolution by Kokkoris, G., Tserepi, A., Boudouvis, A. G., Gogolides, E.

“…A combined simulator linking gas flux data from a plasma reactor (experimental or simulated) to the feature profile evolution during etching/deposition…”
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Modeling of line edge roughness transfer during plasma etching by Constantoudis, V., Kokkoris, G., Xydi, P., Patsis, G.P., Gogolides, E.

“…Although a lot of interest has been devoted to the sidewall roughness of resist lines after lithography (usually called resist line edge roughness, LER), much…”
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Si etching in high-density SF6 plasmas for microfabrication: surface roughness formation by GOGOLIDES, E, BOUKOURAS, C, KOKKORIS, G, BRANI, O, TSEREPI, A, CONSTANTOUDIS, V

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Stochastic simulation studies of molecular resists for the 32 nm technology node by DRYGIANNAKIS, D, PATSIS, G. P, TSIKRIKAS, N, KOKKORIS, G, BOUDOUVIS, A, RAPTIS, I, GOGOLIDES, E, ARGITIS, P

“…Experiments and simulations suggest that low-molecular-weight resist materials could result in low line-edge roughness (LER) which is a critical parameter for…”
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Integrated plasma processing simulation framework, linking tool scale plasma models with 2D feature scale etch simulator by Hauguth, M., Volland, B.E., Ishchuk, V., Dressler, D., Danz, T., Rangelow, I.W., Kokkoris, G., Gogolides, E., Goodyear, A., Cooke, M.

“…An integrated, extensible, full featured inductively coupled plasma (ICP) reactor simulation environment with a 2D feature scale etch simulator is presented…”
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Stochastic simulation studies of molecular resists for the 32nm technology node by Drygiannakis, D., Patsis, G.P., Tsikrikas, N., Kokkoris, G., Boudouvis, A., Raptis, I., Gogolides, E., Argitis, P.

“…Experiments and simulations suggest that low-molecular-weight resist materials could result in low line-edge roughness (LER) which is a critical parameter for…”
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