Search Results - "Klapka, I"

Effect of geometrical nonlinearity on MEMS thermoelastic damping by Méndez, C., Paquay, S., Klapka, I., Raskin, J.-P.

“…Although the thermoelastic damping is a direct consequence of thermodynamic relations, its influence in macroscopic systems can be considered as negligible…”
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Design of a new finite element programming environment by Cardona, A, Klapka, I, Geradin, M

“…This paper presents the architecture for a new finite element program written in the C++ programming language. A powerful command interpreter allows the user…”
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Model of electrostatic actuated deformable mirror using strongly coupled electro-mechanical finite element by Rochus, Véronique, Golinval, Jean-Claude, Louis, Christophe, Mendez, Carlos, Klapka, Igor

“…The aim of this paper is to deal with multi-physics simulation of micro-electro-mechanical systems (MEMS) based on an advanced numerical methodology. MEMS are…”
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Model of Electrostatic Actuated Deformable Mirror Using Strongly Coupled Electro-Mechanical Finite Element by Rochus, V, Golinval, J. -C, Louis, C, Mendez, C, Klapka, I

“…Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006) The aim of this paper is to deal…”
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3-D Self-Assembled Soi Mems: An Example of Multiphysics Simulation by Mendez, C, Louis, C, Paquay, S, De Vincenzo, P, Klapka, I, Rochus, V, Iker, F, André, Nicolas, Raskin, J. -P

“…Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006) MEMS devices are typical systems…”
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Modeling of the Fabrication and Operation of 3-D Self-Assembled SOI MEMS by Mendez, C., Louis, C., Paquay, S., De Vincenzo, P., Klapka, I., Rochus, V., Iker, F., Andre, N., Raskin, J.-P.

“…In this paper we present out-of-plane 3D self assembled SOI (silicon-on-insulator) MEMS that can be directly integrated to the electronic components. Because…”
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