Search Results - "Kishimura, Shinji"
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Synthesis of Poly[N-(1-adamantyl)vinylsulfonamide-c o- 2-(2-methyl)adamantyl methacrylate] for 193 nm Lithography
Published in Macromolecules (19-04-2005)Get full text
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Design Concepts of Single-Layer Resists for Vacuum Ultraviolet Lithography
Published in Japanese Journal of Applied Physics (01-12-1999)“…We investigated the possible use of single-layer resists in vacuum ultraviolet (VUV) lithography. The transmittances in the VUV region of commonly used…”
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Journal Article -
3
Dissolution Rate Analysis of ArF Resists Based on the Percolation Model
Published in Japanese Journal of Applied Physics (01-07-1999)“…We investigated the dissolution properties of ArF-resist base polymers and ArF resist in order to study their development mechanism. We measured the…”
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4
Study of the Bottom Antireflective Coating Process Using a High-Transparency Resist for ArF Excimer Laser Lithography
Published in Japanese Journal of Applied Physics (01-12-1998)“…We have investigated the effect of substrate reflectivity and resist transparency on resist performance in ArF excimer laser lithography with bottom…”
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Journal Article -
5
Effect of the Structure of a Photoactive Compound on the Dissolution Inhibition Effect
Published in Japanese Journal of Applied Physics (01-10-1989)“…The dependence of the dissolution rate of unexposed resist on the concentration of a developer was investigated using a practical resist composition and its…”
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6
Effect of anion in developer on dissolution characteristics of photoresist
Published in Japanese Journal of Applied Physics (1991)“…The dissolution characteristics of photoresist in developers with added tetramethylammonium salts are discussed. It was observed that the dissolution rate of…”
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7
New Photoresist Materials for 157-nm Lithography. Poly[Vinylsulfonyl Fluoride-c o-4-(1,1,1,3,3,3-hexafluoro-2-hydroxypropyl)-styrene] Partially Protected with tert-Butoxycarbonyl
Published in Chemistry of materials (08-04-2003)“…Our molecular orbital calculations predicted excellent transparencies of molecules having sulfonyl fluoride groups in the vacuum ultraviolet (VUV) region. An…”
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Thin organic photoconductive film image sensors with extremely high saturation of 8500 electrons/µm2
Published in 2013 Symposium on VLSI Technology (01-06-2013)“…We have developed an image sensor with thin organic photoconductive film (OPF) laminated on CMOS circuits. Owing to high capacity of a charge storage node, the…”
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Conference Proceeding -
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Insolubilization mechanism of chemically amplified negative photoresists
Published in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures (01-11-1993)“…This article reports on the difference of chemical reactions of polyvinylphenol (PVP) and novolak resin as a base polymer with a melamine cross‐linker…”
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Conference Proceeding -
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Improvement of Dry Etching Resistance of Resists by Deep UVCure
Published in Japanese Journal of Applied Physics (01-01-1999)“…The improvement of dry etching resistance of photoresists by the deep UV cure has been attempted. We have tried deep UV cure under N 2 gas flow for KrF…”
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Challenges to 0.1 µm Resolution Capability in ArF Single Layer Resist Process with Weak Resolution Enhancement Techniques
Published in Japanese Journal of Applied Physics (01-12-1998)“…We examine the resolution capability of the ArF single layer resist process with weak resolution enhancement techniques. To do this, annular illumination and…”
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Journal Article -
12
Thin organic photoconductive film image sensors with extremely high saturation of 8500 electrons/µm2
Published in 2013 Symposium on VLSI Circuits (01-06-2013)“…We have developed an image sensor with thin organic photoconductive film (OPF) laminated on CMOS circuits. Owing to high capacity of a charge storage node, the…”
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Conference Proceeding -
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Study Of Bottom Antireflective Coating Process Using A High-Transparency Resist For ArF Excimer Laser Lithography
Published in Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135) (1998)“…In this study, we investigated the effect of substrate reflectivity and resist transparency on the resist performance, and the controllability of critical…”
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Conference Proceeding -
14
Design concepts of single-layer-resists for VUV lithography
Published in Digest of Papers. Microprocesses and Nanotechnology '99. 1999 International Microprocesses and Nanotechnology Conference (1999)“…We have studied the design of single-layer-resists for VUV lithography. From the point of view of transparency, phenol resins may be used as well as…”
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Conference Proceeding -
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Approach of various polymers to 157 nm single-layer resists
Published in Digest of Papers Microprocesses and Nanotechnology 2000. 2000 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.00EX387) (2000)“…Vacuum ultraviolet (VUV) lithography using the F/sub 2/ excimer laser (157 nm) has been proposed as the most promising candidates for 100-70 nm rule device. We…”
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Conference Proceeding -
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Lithography solution for 65-nm node system LSIs
Published in 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) (2002)“…For 65-nm node devices, we have systematically investigated the lithographic margin of electron-beam projection lithography (EPL), ArF lithography and vacuum…”
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Conference Proceeding -
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Multi-generation device fabrication by ArF lithography
Published in International Electron Devices Meeting. IEDM Technical Digest (1997)“…Summary form only given. Although ArF excimer laser lithography is expected to attain the highest resolution possible in optical lithography, its application…”
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Conference Proceeding