Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires

We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a so...

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Bibliographic Details
Published in:	Polymer (Guilford) Vol. 50; no. 23; pp. 5533 - 5538
Main Authors:	Kirkby, E.L., Michaud, V.J., Månson, J.-A.E., Sottos, N.R., White, S.R.
Format:	Journal Article
Language:	English
Published:	Kidlington Elsevier Ltd 03-11-2009 Elsevier
Subjects:	Applied sciences Exact sciences and technology Mechanical properties Microcapsule Organic polymers Physicochemistry of polymers Properties and characterization Self-healing polymer Shape memory alloy wire Self-healing polymer Shape memory alloy wire Microcapsule Mechanical properties Epoxy resin Experimental study Wire Fracture toughness Shape memory alloy Norbornene derivative polymer Mechanism of action Cicatrization Crack
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Summary:	We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires. [Display omitted]
Bibliography:	ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23
ISSN:	0032-3861 1873-2291
DOI:	10.1016/j.polymer.2009.05.014