Search Results - "Kimmo Kaija"

Analysis of mechanical performance of silver inkjet-printed structures by Caglar, U., Kimmo Kaija, Mansikkamaki, P.

“…We report the mechanical performance of the structure of sintered silver ink used in inkjet printing, having a particle size of 3-7 nm. Tensile adhesion…”
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Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package by Pekkanen, Ville, Mäntysalo, Matti, Kaija, Kimmo, Mansikkamäki, Pauliina, Kunnari, Esa, Laine, Katja, Niittynen, Juha, Koskinen, Santtu, Halonen, Eerik, Caglar, Umur

“…The printed interconnections for encapsulated electronic packages using nanoparticle metal inks and polymer dielectrics have been demonstrated. The printing…”
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Evaluation of Inkjet Technology for Electronic Packaging and System Integration by Mantysalo, Matti, Mansikkamaki, Pauliina, Miettinen, Jani, Kaija, Kimmo, Pienimaa, Seppo, Ronkka, Risto, Hashizume, Kenichi, Kamigori, Akiko, Matsuba, Yorishige, Oyama, Kenshu, Terada, Nobuto, Saito, Hiroshi, Kuchiki, Mikiharu, Tsubouchi, Mikihiko

“…The main trend of the electronic packaging industry has been on increasing the packaging density and increasing the functionality, but now also the interest on…”
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Inkjetting dielectric layer for electronic applications by Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Koskinen, Santtu, Niittynen, Juha, Halonen, Eerik, Mansikkamäki, Pauliina

“…Printed electronics is expected to increase its market share significantly in near future. The emerging applications include e.g. display applications, RFID…”
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Functional fluid jetting performance optimization by Pekkanen, Ville, Kaija, Kimmo, Mäntysalo, Matti, Kunnari, Esa, Niittynen, Juha, Mansikkamäki, Pauliina

“…The manufacturing method utilizing digital printing technology offers alternatives to create electronic structures to be used even in microelectronic…”
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Controlling warpage of molded package for inkjet manufacturing by Kaija, Kimmo, Pekkanen, Ville, Mäntysalo, Matti, Mansikkamäki, Pauliina

“…A system consisting of four silicon dies and several discrete components was encapsulated with epoxy mold material and the package was used for the evaluation…”
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Molded Substrates for Inkjet Printed Modules by Miettinen, J., Kaija, K., Mantysalo, M., Mansikkamaki, P., Kuchiki, M., Tsubouchi, M., Ronkka, R., Hashizume, K., Kamigori, A.

“…Ever increasing demand for high-performance, miniaturized, low-cost, and more environmentally conscious targets set high requirements for electronics packaging…”
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Inkjet printed System-in-Package design and manufacturing by Miettinen, Jani, Pekkanen, Ville, Kaija, Kimmo, Mansikkamäki, Pauliina, Mäntysalo, Juha, Mäntysalo, Matti, Niittynen, Juha, Pekkanen, Jussi, Saviauk, Taavi, Rönkkä, Risto

“…Additive manufacturing technology using inkjet offers several improvements to electronics manufacturing compared to current non-additive masking technologies…”
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The effect of conductor thickness in passive inkjet printed RFID tags by Virtanen, Juha, Bjorninen, Toni, Ukkonen, Leena, Kaija, Kimmo, Joutsenoja, Timo, Sydanheimo, Lauri, Elsherbeni, Atef Z

“…This paper investigates the effects of conductor thickness on the performance of passive RFID tags fabricated using inkjet technology. Judging from the…”
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Capability of inkjet technology in electronics manufacturing by Mantysalo, M., Pekkanen, V., Kaija, K., Niittynen, J., Koskinen, S., Halonen, E., Mansikkamaki, P., Hameenoja, O.

“…The past decade has seen a growing interest in additive manufacturing and printable electronics. The main markets are expected to be among low-cost mass…”
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System design issues for 3D system-in-package (SiP) by Miettinen, J., Mantysalo, M., Kaija, K., Ristolainen, E.O.

“…Development in electronics is driven by device and market needs. This paper focuses on system design issues for three-dimensional packaging technology and…”
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Evaluation of printed electronics manufacturing line with sensor platform application by Halonen, E., Kaija, K., Mantysalo, M., Kemppainen, A., Osterbacka, R., Bjorklund, N.

“…The increasing demands in electronics manufacturing are driving the development of new manufacturing processes. Printing processes, such as gravure,…”
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