Search Results - "Kim, Hyoung Joon"

Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection by LEE, Kiwon, KIM, Hyoung-Joon, YIM, Myung-Jin, PAIK, Kyung-Wook

“…In this paper, a novel anisotropic conductive film (ACF) flip chip bonding method using ultrasonic vibration for flip chip interconnection is demonstrated. The…”
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Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability by Hyoung-Joon Kim, Joo Yeon Lee, Kyung-Wook Paik, Kwang-Won Koh, Won, J., Sihyun Choe, Jin Lee, Jung-Tak Moon, Yong-Jin Park

“…Copper wire bonding is an alternative interconnection technology that serves as a viable, and cost saving alternative to gold wire bonding. Its excellent…”
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Effects of Thermal Cycling on Material Properties of Nonconductive Pastes (NCPs) and the Relationship Between Material Properties and Warpage Behavior During Thermal Cycling by Jang, Kyung-Woon, Kim, Hyoung-Joon, Chung, Chang-Kyu, Paik, Kyung-Wook

“…In this paper, the effects of thermal cycling on material properties such as coefficient of thermal expansion (CTE), modulus, and glass transition temperature…”
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Hyperinvariant subspaces for quasinilpotent operators on Hilbert spaces by Kim, Hyoung Joon

“…In this paper, we employ the model theory due to C. Foias and C. Pearcy and the notion of Enflo's extremal vectors of quasinilpotent operators to study the…”
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Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds by McCracken, Michael James, Koda, Yusuke, Hyoung Joon Kim, Mayer, Michael, Persic, John, June Sub Hwang, Jeong-Tak Moon

“…The application of an alternative method of bond monitoring during high-temperature aging is reported using a custom made test chip with piezoresistive…”
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Multimode shunt damping of piezoelectric smart panel for noise reduction by KIM, Jaehwan, KIM, Joon-Hyoung

“…Multimode shunt damping of piezoelectric smart panel is studied for noise reduction. Piezoelectric smart panel is a plate structure on which a piezoelectric…”
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Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish by Kim, Hyoung-Joon, Paik, Kyung-Wook

“…The effect of final metal finishes of Cu electrodes on the adhesion and reliability of anisotropic conductive film (ACF) joints was investigated. Two different…”
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Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability by GAM, Sang-Ah, KIM, Hyoung-Joon, CHO, Jong-Soo, PARK, Yong-Jin, MOON, Jeong-Tak, PAIK, Kyung-Wook

“…Finer pitch wire bonding technology has been needed since chips have more and finer pitch I/Os. However, finer Au wires are more prone to Au-Al bond…”
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Plasma-Assisted Dry Etching of Ferroelectric Capacitor Modules and Application to a 32M Ferroelectric Random Access Memory Devices with Submicron Feature Sizes by Lee, Sang-Woo, Joo, Suk-Ho, Cho, Sung Lae, Son, Yoon-Ho, Lee, Kyu-Mann, Nam, Sang-Don, Park, Kun-Sang, Lee, Yong-Tak, Seo, Jung-Suk, Kim, Young-Dae, An, Hyeong-Geun, Kim, Hyoung-Joon, Jung, Yong-Ju, Heo, Jang-Eun, Lee, Moon-Sook, Park, Soon-Oh, Chung, U-In, Moon, Joo-Tae

“…Authors report the ferroelectric property of patterned submicron capacitor modules with a stack height of 380 nm, where the 100 nm-thick Pb(Zr, Ti)O3 (PZT)…”
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Tetrasomy 21 as a sole acquired abnormality without GATA1 gene mutation in pediatric acute megakaryoblastic leukemia: A case report and review of the literature by Shin, Myung-Geun, Choi, Hyun-Woo, Kim, Hye-Ran, Kim, Mi-Ji, Baek, Hee-Jo, Han, Dong-Kyun, Kook, Hoon, Hwang, Tai-Ju, Kim, Hyoung-Joon, Kim, Soo-Hyun, Shin, Jong-Hee, Suh, Soon-Pal, Ryang, Dong-Wook

“…Abstract We report a case of pediatric acute megakaryocytic leukemia (AMKL) showing 48,XX,+21,+21 as a sole acquired cytogenetic abnormality without the…”
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Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability by KIM, Hyoung-Joon, CHO, Jong-Soo, PARK, Yong-Jin, LEE, Jin, PAIK, Kyung-Wook

“…The main purposes for developing low-alloyed Au bonding wires were to increase wire stiffness and to control the wire loop profile and heat-affected zone…”
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Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability by KIM, Hyoung-Joon, CHUNG, Chang-Kyu, KWON, Yong-Min, YIM, Myung-Jin, HONG, Soon-Min, JANG, Se-Young, MOON, Young-Joon, PAIK, Kyung-Wook

“…The formation of process-related bubbles that become entrapped inside the anisotropic conductive film (ACF) layer during bonding processes remains an issue…”
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A Note on the Invariant Subspace Problem by Kim, Hyoung Joon, Lee, Woo Young

“…The invariant subspace problem asks whether every bounded linear operator on a separable complex Hilbert space has a nontrivial invariant subspace. This…”
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Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish by Hyoung-Joon Kim, Kyung-Wook Paik

“…The effect of final metal finishes of Cu electrodes on the adhesion and reliability of anisotropic conductive film (ACF) joints was investigated. Two different…”
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Hyperinvariant subspaces for operators having a compact part by Kim, Hyoung Joon

“…It is well known that if T = A ⊕ B , where A is compact, then T has a nontrivial hyperinvariant subspace. In this paper, we try to solve the hyperinvariant…”
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Effects of metal surface finish on the anisotropic conductive adhesives (ACAs) joints by Hyoung-Joon Kim, Kyung-Wook Paik

“…This work was performed to investigate the effect of final surface finish of Cu electrodes on the adhesion and reliability of anisotropic conductive films…”
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Curing and bonding behaviors of anisotropic conductive films (ACFs) by ultrasonic vibration for flip chip interconnection by Ki Won Lee, Hyoung Joon Kim, Myung Jin Yim, Kyung Wook Paik

“…In this study, the curing and bonding behaviors of ACFs by ultrasonic vibration for flip chip interconnection were investigated using a 40 kHz ultrasonic…”
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Products of truncated Hankel operators by Kang, Dong-O, Kim, Hyoung Joon

“…We characterize the pairs of truncated Hankel operators on the model spaces Ku2(=H2⊖uH2) whose products result in truncated Toeplitz operators when the inner…”
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Study on bubble formation in rigid-flexible substrates bonding using anisotropic conductive films (ACFs) and their effects on the ACF joint reliability by Hyoung-Joon Kim, Chang-Kyu Chung, Myung-Jin Yim, Soon-Min Hong, Se-Young Jang, Young-Joon Moon, Kyung-Wook Paik

“…Because of downsizing of electronic products and cost effectiveness, rigid substrate-flexible substrate (RS-FS) bonding technology using ACFs becomes more…”
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Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications by Myung-Jin Yim, Jin-Sang Hwang, Jin-Gu Kim, Hyoung-Joon Kim, Woonseong Kwon, Kyung Woon Jang, Kyung Wook Paik

“…In this paper, we present the development work of anisotropic conductive adhesives (ACA) with particular emphasis on the enhanced thermal conductivity of ACAs…”
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