Search Results - "Khoshnaw, F."
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1
Effect of silver content on the wear and mechanical properties of powder metallurgical Ti-5Al-2.5Fe-xAg alloys
Published in Journal of mining and metallurgy. Section B, Metallurgy (2020)“…In the current research, the effect of Ag on the mechanical properties of Ti5Al2.5Fe alloy was investigated. The Ti5Al2.5Fe alloy, with different amounts of Ag…”
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Journal Article -
2
Effect of aging time and temperature on exfoliation corrosion of aluminum alloys 2024-T3 and 7075-T6
Published in Materials and corrosion (01-05-2007)“…Two types of aluminum alloys, 2024‐T3 and 7075‐T6, have been selected in this study to investigate the effect of metallurgical aspects on exfoliation…”
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3
Effect of the load location along the involute curve of spur gears on the applied stress at the fillet radius
Published in Materialwissenschaft und Werkstofftechnik (01-06-2008)“…In this study, attempts are carried out to determine the amount of stress at the fillet radius region of spur gears when the applied load location changes,…”
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Journal Article -
4
EFFECT OF SILVER CONTENT ON THE WEAR AND MECHANICAL PROPERTIES OF POWDER METALLURGICAL Ti-5Al-2.5Fe-x Ag ALLOYS
Published in Journal of mining and metallurgy. Section B, Metallurgy (01-01-2020)“…In the current research, the effect of Ag on the mechanical properties of Ti5Al2.5Fe alloy was investigated. The Ti5Al2.5Fe alloy, with different amounts of Ag…”
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Journal Article -
5
Technical and Environmental Study of Acid Gas Reinjection into SEEPAGE bed in an Oil & Gas Field of Erbil Governorate
Published in Zanco journal of pure and applied sciences (08-08-2019)“…Sour gases are nowadays becoming a focusing issue for environmental agencies consideration in oil and gas projects. As these gases mainly consist of H2S and…”
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Journal Article -
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Glass as a Substrate for High Density Electrical Interconnect
Published in 2008 10th Electronics Packaging Technology Conference (01-12-2008)“…The high volume production of substrates able to support high density interconnection is becoming increasingly difficult as the pitch of devices continues to…”
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