Search Results - "Keser, B."

A rare solitary fibrous tumour of the ascending mesocolon: a case report by Keser, B N, Kırman, Ü N, Aktemur, G, Alimoĝlu, O

“…Solitary fibrous tumours are rare mesenchymal tumours which mostly arise from pleura. Such tumours occurring in the mesocolon are exceptionally rare. A…”
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Advanced Packaging: The Redistributed Chip Package by Keser, B., Amrine, C., Trung Duong, Hayes, S., Leal, G., Lytle, W., Mitchell, D., Wenzel, R.

“…The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance, integrated alternative to current…”
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Evaluation of commercially available, thick, photosensitive films as a stress compensation layer for wafer level packaging by Keser, B., Prack, E.R., Fang, T.

“…Commercially available, photosensitive dielectrics for use as a bump encapsulation or "stress compensation layer" (SCL) for wafer level chip-scale packaging…”
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Encapsulated double-bump WL-CSP: design and reliability by Keser, B., Yeung, B., White, J., Fang, T.

“…A new type of wafer level package has been designed and fabricated by using an encapsulation material, which is applied directly to a bumped wafer, thereby…”
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Fab Integrated Packaging (FIP): a new concept for high reliability wafer-level chip size packaging by Topper, M., Auersperg, J., Glaw, V., Kaskoun, K., Prack, E., Keser, B., Coskina, P., Jager, D., Fetter, D., Ehrmann, O., Samulewicz, K., Meinherz, C., Fehlberg, S., Karduck, C., Reichl, H.

“…Wafer Level Packaging has the highest potential for future single chip packages. The package is completed directly on the wafer then singulated by dicing for…”
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Improvement in WL-CSP reliability by wafer thinning by Li Wetz, White, J., Keser, B.

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Chip size packages with wafer-level ball attach and their reliability by Cergel, L., Wetz, L., Keser, B., White, J.

“…A new wafer level package has been designed and fabricated in which the entire package can be constructed at the wafer level using batch processing. Peripheral…”
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Activation of the Ah Receptor Signaling Pathway by Prostaglandins by Seidel, Shawn D., Winters, Greg M., Rogers, William J., Ziccardi, Michael H., Li, Violet, Keser, Bart, Denison, Michael S.

“…The aryl hydrocarbon receptor (AhR) is a ligand‐dependent transcription factor that mediates many of the biological and toxicological actions of a diverse…”
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WL-CSP reliability with various solder alloys and die thicknesses by Keser, Beth, Wetz, Li, White, Jerry

“…WL-CSP is a low profile, true chip size package that is entirely built on a wafer using front-end and back-end processing. A new wafer level chip-scale package…”
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Advanced Packaging: The Redistributed Chip Package by Keser, B., Amrine, C., Trung Duong, Hayes, S., Leal, G., Lytle, W., Mitchell, D., Wenzel, R.

“…The Redistributed Chip Package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance, integrated alternative to current…”
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Şanlıurfa'da 4-6 yaş erkek çocuklarda dış genital organ bozukluğu by YENİ, Ercan, VERİT, Ayhan, ÇİFTÇİ, Halil, SAVAŞ, Murat, KESER, B. Sabri, KARATAŞ, Ömer Faruk

“…Bu çalışmada Şanlıurfa il merkezinde öğrenim gören ana okulu çağı (4-6 yaş) erkek çocuklarda dış genital organ bozukluğu sıklığı ve çeşitliliğini belirlemeyi…”
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The Redistributed Chip Package: A Breakthrough for Advanced Packaging by Keser, B., Amrine, C., Trung Duong, Fay, O., Hayes, S., Leal, G., Lytle, W., Mitchell, D., Wenzel, R.

“…The redistributed chip package (RCP) is a substrate-less embedded chip package that offers a low-cost, high performance, integrated alternative to current…”
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Reliability evaluation on low k wafer level packages by Yadav, P., Kalchuri, S., Keser, B., Zang, R., Schwarz, M., Stone, B.

“…Wafer Level Package (WLP) technology has seen tremendous advances in recent years and is rapidly being adopted at the 65 nm Low-K silicon node. For a true WLP,…”
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Intracellular pathways and degradation of endosomal contents in basal epithelial cells of freshwater sponges (Porifera, Spongillidae) by Hahn-Keser, Beate, Stockem, W.

“…The digestive system expressed by basal epithelial cells of the freshwater sponges Spongilla lacustris and Ephydatia muelleri is mainly represented by a…”
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Exploration of the design space of wafer level packaging through numerical simulation by Zhongping Bao, Burrell, J., Keser, B., Yadav, P., Kalchuri, S., Zang, Ricky

“…Wafer Level Packaging (WLP) refers to the technology that integrated circuits are packaged at wafer level and after singulation such chips are then connected…”
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Emerging technologies for wireless handsets by Pacheco, S., Keser, B., Lianjun Liu, Abrokwah, J.

“…This paper discuss three emerging disruptive technologies that have the potential to simplify front-end module designs as the wireless handset community moves…”
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Implementation of a mobile phone module with redistributed chip packaging by Ramanathan, L.N., Keser, B., Amrine, C., Trung Duong, Hayes, S., Leal, G., Mangrum, M., Mitchell, D., Wenzel, R.

“…The redistributed chip packaging is an embedded chip technology that eliminates the need for wirebonds and flip chip bumps. This technology enables smaller…”
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Henry Albert Gosse (1754-1816) founder of the Swiss Society of Natural Sciences by Késer, B

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