Search Results - "Keng Yuen, Jason Au"

Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink by Feng, Huicheng, Tang, Gongyue, Zhang, Xiaowu, Lau, Boon Long, Jong, Ming Chinq, Au, Keng Yuen Jason, Ong, Jun Wei Javier, Chui, King Jien, Li, Jun, Li, Hongying, Vinh Le, Duc, Lou, Jing

“…Two-phase liquid cooling can achieve high heat flux and is therefore a key method for heat dissipation of high-power microelectronics. In this study, we…”
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Development of 4 die stack module using Hybrid bonding approach by Chong, Ser Choong, Keng Yuen, Jason Au, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Rao, Vempati Srinivasa

“…Die stacking is commonly used in memory modules. Solder micro-bumps and through silicon via (TSVs) are common interconnects, and it may not viable or suitable…”
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Development of Chip to Wafer Assembly with CuSnAg Microbump on Solder on Pad Interposer using Thermocompression and Solder Reflow by Keng Yuen, Jason Au, Chong, Ser Choong, Daniel, Ismael Cereno

“…Chip to wafer (C2W) bonding to form interconnect is not new to the industry. However, if the bottom wafer has thick (i,e ≥ 10um) Cu RDL layers, the CTE…”
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Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding by Chong, Ser Choong, Au Keng Yuen, Jason, Sekhar, Vasarla Nagendra, Cereno Daniel, Ismael, Kumar, Mishra Dileep, Srinivasa Rao, Vempati

“…Wafer to wafer hybrid bonding has been established to form fine pitch interconnections for high density I/O applications [1], [2]. However, this approach has…”
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Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs by Feng, Huicheng, Tang, Gongyue, Zhang, Xiaowu, Lau, Boon Long, Jong, Ming Chinq, Au, Keng Yuen Jason, Chui, King Jien, Lou, Jing, Li, Hongying, Le, Duc Vinh

“…This paper presents a novel two-phase liquid cooling solution of high-power integrated circuit (IC) chips using embedded micro-pin fin heat sink (MPFHS). A…”
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Development of Crossflow Manifold for Two-Phase Liquid Cooling of 3D ICs via 3D Printing by Feng, Huicheng, Tang, Gongyue, Zhang, Xiaowu, Lau, Boon Long, Jong, Ming Chinq, Au, Keng Yuen Jason, Ong, Jun Wei Javier, Chui, King Jien, Li, Jun, Li, Hongying, Le, Duc Vinh, Lou, Jing

“…Moore's Law of ICs develops towards an end due to the limitations in physics, materials etc. However, Moore's Law of Packaging provides new avenues for the…”
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