Evaluation of Ag-sinter pastes for the die attachment in power electronic modules using design of experiments

Silver sintering is a potential die attach technology to replace the solder technology for power electronic systems. A design of experiments (DoE) is performed in order to investigate the influences of sinter parameters as sinter pressure, temperature, duration, drying temperature and the interactio...

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Bibliographic Details
Published in:2016 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe) pp. 1 - 10
Main Authors: Bao Ngoc An, Kempf, Maurizio, Leyrer, Benjamin, Blank, Thomas, Kolb, Johannes, Weber, Marc
Format: Conference Proceeding
Language:English
Published: Jointly owned by IEEE-PELS and EPE Association 01-09-2016
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Summary:Silver sintering is a potential die attach technology to replace the solder technology for power electronic systems. A design of experiments (DoE) is performed in order to investigate the influences of sinter parameters as sinter pressure, temperature, duration, drying temperature and the interactions of these parameters on the shear strength of the Ag-sinter connection. Four sinter pastes have been evaluated. All significant parameters and parameter interactions are identified in order to derive a quadratic model function used to fit the measured shear values. This fitted function predicts the shear strength as a function of the significant parameters and, moreover, the function is used to determine the optimal sinter parameter space. The shear tests reveal that for three tested sinter pastes an excellent average shear result exceeding 90 MPa is achieved. One sinter paste outperforms these results by an average shear strength of 121 MPa. The DoE shows that all sinter pastes are significantly dependent on the sinter pressure and sinter temperature. However one sinter paste is influenced by the drying temperature and a second sinter paste is independent of the drying temperature as well as the sinter duration.
DOI:10.1109/EPE.2016.7695455