Search Results - "Ke, J.H."

Coating thickness effect of metallic glass thin film on the fatigue-properties improvement of 7075 aluminum alloy by Tsai, P.H., Li, T.H., Hsu, K.T., Ke, J.H., Jang, J.S.C., Chu, J.P.

“…The outstanding strength-to-weight performance of 7075 aluminum alloy (AA 7075) has prompted its wide-scale application to light-weight sport equipment,…”
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Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing by Ke, J.H., Chuang, H.Y., Shih, W.L., Kao, C.R.

“…Dissolution of cathode metallization is one of the key degradation processes for solder interconnects under electron current stressing. Very recently, several…”
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Effect of post-annealing on the optoelectronic properties of ZnO:Ga films prepared by pulsed direct current magnetron sputtering by Yen, W.T., Lin, Y.C., Yao, P.C., Ke, J.H., Chen, Y.L.

“…In this study, highly conductive films of ZnO:Ga (GZO) were deposited by pulsed direct current magnetron sputtering to explore the effect of post-annealing on…”
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Preparation and characterization of Cu(In,Ga)(Se,S)2 films without selenization by co-sputtering from Cu(In,Ga)Se2 quaternary and In2S3 targets by Lin, Y.C., Ke, J.H., Yen, W.T., Liang, S.C., Wu, C.H., Chiang, C.T.

“…▶ We report a chalcopyrite CIGS films prepared by co-sputtering a quaternary alloy target and an In2S3 binary target with a one-stage annealing process without…”
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Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing by Huang, T.C., Yang, T.L., Ke, J.H., Hsueh, C.H., Kao, C.R.

“…Electron current stressing of Ni/Sn3Ag/Ni solder joints was conducted in a straight-line configuration to avoid the complication of current crowding. It was…”
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Control of surface induced phase separation in immiscible semiconductor alloy core-shell nanowires by Arjmand, M., Ke, J.H., Szlufarska, I.

“…[Display omitted] •Developed phase field model of core-shell nanowire heterostructures.•Provided a pathway to control the thermodynamically unstable…”
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Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates – A simulation study by Ke, J.H., Gao, Y., Kao, C.R., Wang, Y.

“…Heteroepitaxial formation of η-Cu6Sn5 intermetallic compound (IMC) on unidirectional Cu has been found to exhibit remarkable microstructural features and…”
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Phase field microelasticity model of dislocation climb: Methodology and applications by Ke, J.H., Boyne, A., Wang, Y., Kao, C.R.

“…We develop a dislocation climb model based on a phase field description that couples non-conservative dislocation motion and vacancy diffusion. A…”
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Mechanism of volume shrinkage during reaction between Ni and Ag-doped Sn by Li, C.C., Ke, J.H., Yang, C.A., Kao, C.R.

“…The volume shrinkage during the solid-state reaction in Ag-doped Sn micro-joints for three-dimensional integrated-circuit applications is measured. It is found…”
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Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing by Ke, J.H., Yang, T.L., Lai, Y.S., Kao, C.R.

“…For solder joints subjected to current stressing, the formation of a pancake-type void in the solder and excessive consumption of the metallization layer are…”
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Surface textured ZnO:Al thin films by pulsed DC magnetron sputtering for thin film solar cells applications by Yen, W.T., Lin, Y.C., Ke, J.H.

“…Transparent conducting thin films of ZnO:Al (Al-doped ZnO, AZO) were prepared via pulsed DC magnetron sputtering with good transparency and relatively lower…”
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Designing a toxic-element-free Ti-based amorphous alloy with remarkable supercooled liquid region for biomedical application by Lin, H.C., Tsai, P.H., Ke, J.H., Li, J.B., Jang, J.S.C., Huang, C.H., Haung, J.C.

“…A series of toxic-element-free Ti–Zr–Ta–Si amorphous alloy ribbons have been successfully prepared by melt-spinning. The differential scanning carlorimetry…”
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Subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip by Chang, W.R., Chen, C.A., Ke, J.H., Lin, T.F.

“…Experiments are conducted here to investigate subcooled flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned…”
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Precipitation induced by diffusivity anisotropy in Sn grains under electron current stressing by Huang, T.C., Yang, T.L., Ke, J.H., Li, C.C., Kao, C.R.

“…Nickel diffuses five orders of magnitude faster along the c-axis of white Sn than along the a-axis. Experimental evidence is presented to show that, when Ni…”
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Saturated flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip by Lie, Y.M., Ke, J.H., Chang, W.R., Cheng, T.C., Lin, T.F.

“…An experiment is carried out here to investigate flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon…”
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Growth characteristics and properties of ZnO:Ga thin films prepared by pulsed DC magnetron sputtering by Yen, W.T., Lin, Y.C., Yao, P.C., Ke, J.H., Chen, Y.L.

“…Transparent conductive ZnO:Ga thin films were deposited on Corning 1737 glass substrate by pulsed direct current (DC) magnetron sputtering. The effects of…”
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Corrosion Evolution of Reinforcing Steel in Concrete under Dry/Wet Cyclic Conditions Contaminated with Chloride by Wei, J., Fu, X.X., Dong, J.H., Ke, W.

“…The corrosion evolution of rebar in concrete was monitored by electrochemical impedance spectroscopy （EIS） under dry/wet alternated accelerated corrosion test…”
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