Search Results - "Kawanabe, Naoki"

High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding by Tatsumi, Kohei, Morisako, Isamu, Wada, Keiko, Fukuomori, Minoru, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Hikita, Masayuki, Kamimura, Rikiya, Kawanabe, Naoki, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in…”
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Capturing intrinsic impact of low-k dielectric stacks and packaging materials on mechanical integrity of Cu/low-k interconnects by Furusawa, Takeshi, Goto, Kinya, Izumitani, Junko, Matsuura, Masazumi, Fujisawa, Masahiko, Kawanabe, Naoki, Hirose, Tetsuya, Hayashi, Eiji, Baba, Shinji, Asano, Yoshinobu, Ichiki, Tsutomu, Takata, Yoshifumi

“…We present a methodology for capturing the intrinsic impact of both low-k dielectric stacks and packaging materials on the mechanical integrity of Cu/low-k…”
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