Search Results - "Kaushik, B K"
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1
Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects
Published in IEEE transactions on electromagnetic compatibility (01-12-2014)“…Mixed carbon nanotube bundles (MCBs) are considered to be highly potential interconnect solutions in the current nanoscale regime. Different MCBs with random…”
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Journal Article -
2
Performance analysis of multilayer graphene nanoribbon (MLGNR) interconnects
Published in Journal of computational electronics (01-06-2016)“…This paper addresses the impact of interlayer resistance due to c-axis resistivity and contact resistance on performance in terms of delay, power dissipation…”
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3
Temperature-Dependent Modeling and Crosstalk Analysis in Mixed Carbon Nanotube Bundle Interconnects
Published in Journal of electronic materials (01-08-2017)“…The temperature-dependent circuit modeling and performance analysis in terms of crosstalk in capacitively coupled mixed carbon nanotube bundle (MCB)…”
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4
Temperature-dependent crosstalk between adjacent MLGNR interconnects of different dimensions and its impact on gate oxide reliability
Published in Journal of computational electronics (01-03-2020)“…A comprehensive analysis is carried out herein on the impact of the interconnect geometry with nanoscale dimensions on the crosstalk-induced gate oxide…”
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5
Analysis of MWCNT and Bundled SWCNT Interconnects: Impact on Crosstalk and Area
Published in IEEE electron device letters (01-08-2012)“…Multiwalled carbon nanotube (MWCNT) and bundled single-walled carbon nanotube (SWCNT) interconnect have provided potentially attractive solution in current…”
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6
Temperature‐dependent modeling and performance analysis of coupled MLGNR interconnects
Published in International journal of circuit theory and applications (01-02-2018)“…The temperature‐dependent circuit modeling and performance in terms of propagation delay, power dissipation, and crosstalk‐induced voltage waveform at the far…”
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7
Effects of process variation in VLSI interconnects - a technical review
Published in Microelectronics international (31-07-2009)“…Purpose - Process variation has become a major concern in the design of many nanometer circuits, including interconnect pipelines. The purpose of this paper is…”
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8
Static and dynamic analysis of organic and hybrid inverter circuits
Published in Journal of computational electronics (01-12-2013)“…This paper explores the possibility of organic-inorganic inverter circuits starting with independent designs of organic thin film transistors. Simulated I – V…”
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9
Bus encoder design for crosstalk and power reduction in RLC modelled VLSI interconnects
Published in Journal of engineering, design and technology (06-07-2015)“…Purpose – This paper aims to reduce the worst-case crosstalk effects for resistance, inductance and capacitance (RLC) interconnects using the bus encoding…”
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10
Voltage scaling - a novel approach for crosstalk reduction in global VLSI interconnects
Published in Microelectronics international (01-01-2007)“…Purpose - To analyze the effect of voltage scaling on crosstalk.Design methodology approach - Voltage scaling has been often used for reducing power…”
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11
Channel length variation effect on performance parameters of organic field effect transistors
Published in Microelectronics (01-12-2012)“…This research paper analyzes, finite element based two dimensional device simulations for top and bottom contact organic field effect transistors (OFETs) by…”
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12
VLSI interconnects and their testing: prospects and challenges ahead
Published in Journal of engineering, design and technology (01-01-2011)“…Purpose - The purpose of this paper is to explore the functioning of very-large-scale integration (VLSI) interconnects and modeling of interconnects and…”
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13
Multiple relaxation investigations in polyetherimide: Thermally stimulated depolarization current technique
Published in Indian journal of pure & applied physics (01-02-2008)“…Thermally stimulated depolarization current (TSDC) technique has been used for investigating various dielectric relaxation processes in polyetherimide. The TSD…”
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14
Boundary scan based testing algorithm to detect interconnect faults in printed circuit boards
Published in Circuit world (01-01-2011)“…Purpose - This paper aims to address the various issues of board-level (off-chip) interconnects testing. A new algorithm based on the boundary scan…”
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15
Analytical modeling and parameter extraction of top and bottom contact structures of organic thin film transistors
Published in Microelectronics (01-09-2013)“…This paper proposes a structure based model of an organic thin film transistor (OTFT) and analyzes its device physics. The analytical model is developed for…”
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16
Optimized quantum implementation of novel controlled adders/subtractors
Published in Quantum information processing (16-04-2023)“…Designing quantum arithmetic logic unit, quantum full adder and quantum full subtractor are the most vital digital circuits. The paper first presents the…”
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17
Analysis of video analytic architectures
Published in 2015 National Conference on Recent Advances in Electronics & Computer Engineering (RAECE) (01-02-2015)“…Video technology is changing rapidly due to the advancement in the sensor technology, transmission bandwidth, higher storage capability and availability of…”
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Conference Proceeding -
18
Memoryless nonlinearity in IT JL FinFET with spacer technology: Investigation towards reliability
Published in Microelectronics and reliability (01-04-2021)“…This work investigates the reliability assessment of high-k spacer and the effect of temperature on the device analog/RF performance for Inverted ‘T' (IT)…”
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19
Statistical variability and sensitivity analysis of dual-k spacer FinFET device-circuit co-design
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01-06-2015)“…High-ft spacer materials have been extensively researched for the suppression of short-channel effects (SCEs) in nano-scaled devices. However, the exorbitant…”
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Conference Proceeding -
20
Effect of contact thickness on electrical properties of Organic Thin Film Transistors
Published in 2013 INTERNATIONAL CONFERENCE ON SIGNAL PROCESSING AND COMMUNICATION (ICSC) (01-12-2013)“…This research paper analyses the electrical performance of various structures of Organic Thin Film Transistors (OTFTs) based upon their current-voltage…”
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Conference Proceeding