Search Results - "Kaur, K.S."
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Development of polystyrene adsorbents functionalized with heterocyclic ligands for selective adsorption of CO2 from CH4 and N2
Published in Separation and purification technology (28-01-2016)“…•Synthesis of novel functionalized polystyrene adsorbents with multiple sites for interaction with CO2.•The six member aromatic heterocyclic ligands…”
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Pulse Chromatographic Studies of Adsorption of CO2, CH4, and N2 Using Amine Functionalized Polystyrene Adsorbents
Published in Separation science and technology (24-03-2015)“…Adsorption of CO 2 , CH 4 , and N 2 was investigated using pulse concentration chromatography on polystyrene functionalized by covalently attached…”
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Laser-induced forward transfer of focussed ion beam pre-machined donors
Published in Applied surface science (15-05-2011)“…► LIFT printing of ZnO films pre-machined using the focussed ion beam technique. ► Debris-free micro-pellets with extremely smooth edges were transferred. ►…”
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Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms
Published in Optics express (02-11-2015)“…This article presents the flip-chip bonding of vertical-cavity surface-emitting lasers (VCSELs) to silicon grating couplers (GCs) via SU8 prisms. The SU8…”
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Direct valorisation of waste cocoa butter triglycerides via catalytic epoxidation, ring‐opening and polymerisation
Published in Journal of chemical technology and biotechnology (1986) (01-09-2017)“…BACKGROUND Development of circular economy requires significant advances in the technologies for valorisation of waste, as waste becomes new feedstock. Food…”
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Equilibrium Adsorption Studies of CO2, CH4, and N2 on Amine Functionalized Polystyrene
Published in Separation science and technology (13-10-2014)“…Adsorption of CO 2 , CH 4 , and N 2 has been investigated using amine functionalized polymeric resins having diethanolamine, imidazole, dimethylamine, and…”
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Chip-Level Interconnections Realized Via the Laser-Induced Forward Transfer Technique
Published in 2014 Asia Communications and Photonics Conference (ACP) (01-11-2014)“…In this paper, successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed…”
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