Search Results - "Kannojia, Harindra Kumar"

A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging by Kannojia, Harindra Kumar, Dixit, Pradeep

“…In recent years, Cu–Sn solid–liquid interdiffusion (SLID) bonding has been used in semiconductor packaging, die-attach, fine-pitch interconnection, and…”
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Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM by Arab, Julfekar, Kannojia, Harindra Kumar, Dixit, Pradeep

“…Experimental investigation into the effect of tool electrode roughness on the geometric characteristics of through-holes formed in glass substrate by…”
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Innovative Integration of Dual Quantum Cascade Lasers on Silicon Photonics Platform by Wang, Dongbo, Kannojia, Harindra Kumar, Jouy, Pierre, Giraud, Etienne, Suter, Kaspar, Maulini, Richard, Gachet, David, Hetier, Léo, Van Steenberge, Geert, Kuyken, Bart

“…For the first time, we demonstrate the hybrid integration of dual distributed feedback (DFB) quantum cascade lasers (QCLs) on a silicon photonics platform…”
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Effect of surface roughness on void formation and intermetallic growth in electrodeposited Cu-Sn stacks by Kannojia, Harindra Kumar, Dixit, Pradeep

“…•Effect of Cu surface roughness on the void formation and IMC growth is demonstrated.•Samples having higher Cu surface roughness were observed to have larger…”
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Fabrication of multiple through-holes in non-conductive materials by Electrochemical Discharge Machining for RF MEMS Packaging by Arab, Julfekar, Mishra, Dileep Kumar, Kannojia, Harindra Kumar, Adhale, Pratik, Dixit, Pradeep

“…Formation of multiple through-holes arrays in a 400 μm thick silica substrate is reported for the first time by a cost-effective electrochemical discharge…”
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Experimental investigations in the intermetallic and microvoid formation in sub-200 °C Cu–Sn bonding by Kannojia, Harindra Kumar, Dixit, Pradeep

“…This paper reports the intermetallic growth and microvoid formation in the Cu–Sn layers, which were annealed at low temperatures (sub-200°C) for durations…”
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Void Formation and Intermetallic Growth in Pulse Electrodeposited Cu-Sn Layers for MEMS Packaging by Kannojia, Harindra Kumar, Sharma, Surender Kumar, Dixit, Pradeep

“…Electrodeposited copper (Cu)-tin (Sn) based solid–liquid interdiffusion (SLID) bonding is becoming popular in wafer-scale packaging of inertial…”
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Design and fabrication of through-glass via (TGV) based 3D spiral inductors in fused silica substrate by Kannojia, Harindra Kumar, Sidhique, Aboobackkar, Shukla, Ambika Shanker, Pednekar, Jaising, Gupta, Shalabh, Dixit, Pradeep

“…Design and fabrication of the through-glass via (TGV) based three-dimensional (3D) spiral inductors in the fused silica substrates by a simpler electrochemical…”
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Challenges in fabrication of high aspect ratio electrostatic comb-drive microactuator using one-step X-ray lithography by Shukla, Rahul, Kannojia, Harindra Kumar, Mukherjee, C., Sankar, P. Ram, Thakur, B. S., Sinha, A. K., Pandey, Dhananjai

“…A High Aspect Ratio (HAR) electrostatic comb-drive microactuator of polymethyl-methacrylate (PMMA) is designed to deliver nearly 40 µm uniaxial displacement at…”
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Laser-Induced Forward Transfer for Assembly of Silicon Micro-Chiplets by Kannojia, Harindra Kumar, Van Steenberge, Geert

“…The semiconductor industry can no longer count on monolithic integration to accomplish the economic benefits of the previous era. Now, new packaging solutions…”
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Assembly of Thin Micro-Chiplets using Laser-Induced Forward Transfer by Kannojia, Harindra Kumar, Van Steenberge, Geert

“…Precise assembly and handling of thin micro-chiplets (i.e., thickness <100 μm) during heterogenous integration is quite challenging with very demanding…”
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Void Formation in Low-Temperature Electroplated Cu-Sn Stack for Hermetic Packaging by Kannojia, Harindra Kumar, Dixit, Pradeep

“…Electrodeposited Cu-Sn based solid-liquid interdiffusion (SLID) bonding is a popular technique used for the hermetic encapsulation in various MEMS…”
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Mid-infrared dual-comb QCLs integrated with beam combiner based on Ge-on-Si platform by Wang, Dongbo, Kannojia, Harindra Kumar, Jouy, Pierre, Giraud, Etienne, Van Steenberge, Geert, Kuyken, Bart

“…Mid-infrared dual-comb spectroscopy, a powerful fast and broadband technique involves two combs that are mixed by free-space beam combining and generating beat…”
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Formation of Through-Wafer 3-D Interconnects in Fused Silica Substrates by Electrochemical Discharge Machining by Kannojia, Harindra Kumar, Arab, Julfekar, Kumar, Ritesh, Pednekar, Jaisingh, Dixit, Pradeep

“…In recent years, the usage of glass-based materials as substrate in radio-frequency (RF) micro-electro-mechanical-systems (MEMS) applications has increased…”
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