Search Results - "Kang, Wonjoon"

Prediction of state of user's behavior using Hidden Markov Model in ubiquitous home network by Wonjoon Kang, Dongkyoo Shine, Doingil Shin

“…In this paper, we used Hidden Markov prediction tools to predict the state of the behavior of users in a ubiquitous home network. The state of the user's…”
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Mechanical, thermal, and electrical analysis of a compliant interconnect by Galloway, J., Syed, A., WonJoon Kang, JinYoung Kim, Cannis, J., Ka, Y., SeungMo Kim, TaeSeong Kim, GiSong Lee, SangHyun Ryu

“…Ball grid array (BGA) package styles use solder balls as electrical interconnects between packages and application boards. Solder balls are rigid and tend to…”
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Detecting and predicting of abnormal behavior using hierarchical Markov model in smart home network by Wonjoon Kang, Dongkyoo Shin, Dongil Shin

“…In this paper, we present an application of the hierarchical hidden Markov model (HHMM) for the problem of predicting the state of human behavior in a smart…”
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Issues in fatigue life prediction model for underfilled flip chip bump by Islam, N., Syed, A., TaeKyeong Hwang, YunHyeon Ka, WonJoon Kang

“…Flip Chip (FC) technology has now become mainstream solution for high-performance packages. From commercial gaming machines to high-reliability servers, FC…”
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Mechanical, thermal and electrical analysis of a compliant interconnect by Galloway, J., Syed, A., WonJoon Kang, Jin Young Khim, Cannis, J., YunHyeon Ka, Seungmo Kim, TaeSeong Kim, GiSong Lee, SangHyun Ryu

“…Ball grid array (BGA) package styles use solder balls as an electrical interconnect between packages and application boards. Solder balls are rigid and tend to…”
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Chip Board Interaction Analysis of 22-NM Fully Depeleted Silicon on Insulator (FD-SOI) Technology in Wafer Level Packaging (WLP) by Cho, Jae Kyu, Paul, Jens, Capecchi, Simone, Breuer, Dirk, Kuechenmeister, Frank, Scott, Doug, Choi, JongJin, Kang, Wonjoon

“…Recently, Wafer Level Packaging (WLP) has been in high demand, especially in mobile device applications as a path to enable miniaturization while maintaining…”
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Effect of mild aging on package drop performance for lead free solders by SeokHo Na, SeWoong Cha, WonJoon Kang, TaeSeong Kim, TaeKyung Hwang, JinYoung Khim

“…There have been tremendous demands on portable electronic devices since last decade and board level drop performance has become one of the major concerns in…”
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Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions by Syed, A., Scanlan, J., Se Woong Cha, Won Joon Kang, Eun Sook Sohn, Tae Seong Kim, Chang Gyun Ryu

“…This paper presents a collection of test data showing how the choice of package design and material can have a different effect on performance depending on the…”
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