The structure and toughness of TiN coatings prepared by modulated pulsed power magnetron sputtering

Titanium nitride (TiN) coatings were prepared on different substrates (Si wafer, M2 steel, glass) by modulated pulsed power (MPP) sputtering and continuous dc magnetron sputtering (dcMS). The structure and properties were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM...

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Bibliographic Details
Published in:Vacuum Vol. 125; pp. 165 - 169
Main Authors: Li, Hongtao, Liu, Yanjie, Jiang, Bailing, Kan, Jinfeng, Liu, Zheng
Format: Journal Article
Language:English
Published: Elsevier Ltd 01-03-2016
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Summary:Titanium nitride (TiN) coatings were prepared on different substrates (Si wafer, M2 steel, glass) by modulated pulsed power (MPP) sputtering and continuous dc magnetron sputtering (dcMS). The structure and properties were characterized using X-ray diffraction (XRD), scanning electron microscopy (SEM), nanoindentation and the Vickers indentation test. It was found that the structure was transformed from the columnar growth to the branched growth as the peak target current density (Id) increased to 0.4 A/cm2. The results of plasticity index δH and microindentation crack showed the toughness was improved. MPP TiN coating could withstand the maximum load of 4.9 N when microindentation crack was first discovered at 0.4 A/cm2 while 0.49 N at 0.02 A/cm2 in dcMS condition. This indicated that the high ion flux bombardment of the MPP plasma could be applied to change the structure and toughen TiN coatings. •TiN coatings were deposited by dcMS and MPP sputtering technique.•The microstructure and toughness of coatings were discussed.•MPP TiN coatings exhibited better toughness than dcMS TiN coating.
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ISSN:0042-207X
1879-2715
DOI:10.1016/j.vacuum.2015.12.020