Search Results - "Kamon, Mattan"
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1
Human–machine collaboration for improving semiconductor process development
Published in Nature (London) (27-04-2023)“…One of the bottlenecks to building semiconductor chips is the increasing cost required to develop chemical plasma processes that form the transistors and…”
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2
Continuation-Based Pull-In and Lift-Off Simulation Algorithms for Microelectromechanical Devices
Published in Journal of microelectromechanical systems (01-10-2014)“…The voltages at which microelectromechanical actuators and sensors become unstable, known as pull-in and lift-off voltages, are critical parameters in…”
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3
Process Variation Analysis of Device Performance Using Virtual Fabrication: Methodology Demonstrated on a CMOS 14-nm FinFET Vehicle
Published in IEEE transactions on electron devices (01-12-2020)“…A new methodology is demonstrated to assess the impact of fabrication inherent process variability on 14-nm fin field effect transistor (FinFET) device…”
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4
Efficient Reduced-Order Modeling of Frequency-Dependent Coupling Inductances associated with 3-D Interconnect Structures
Published in 32nd Design Automation Conference (1995)“…Since the first papers on asymptotic waveform evaluation (AWE), reduced order models have become standard for improving interconnect simulation efficiency, and…”
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Conference Proceeding -
5
FASTHENRY: a multipole-accelerated 3-D inductance extraction program
Published in IEEE transactions on microwave theory and techniques (01-09-1994)“…A mesh analysis equation formulation technique combined with a multipole-accelerated Generalized Minimal Residual (GMRES) matrix solution algorithm is used to…”
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6
A coordinate-transformed Arnoldi algorithm for generating guaranteed stable reduced-order models of RLC circuits
Published in Computer methods in applied mechanics and engineering (12-02-1999)“…Since the first papers on asymptotic waveform evaluation (AWE), Padé-based reduced order models have become standard for improving coupled circuit-interconnect…”
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7
Extraction of Frequency Dependent Macromodels for Mems Squeezed-Film Damping Effects
Published in Journal of mechanics (01-12-2005)“…In this paper, an efficient macromodel extraction technique for dynamical MEMS gas damping effects is presented. The technique applies an Arnoldi-based…”
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8
FastPep: a fast parasitic extraction program for complex three-dimensional geometries
Published in 1997 Proceedings of IEEE International Conference on Computer Aided Design (ICCAD) (1997)“…In this paper we describe a computationally efficient approach to generating reduced-order models from PEEC-based three-dimensional electromagnetic analysis…”
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Conference Proceeding Journal Article -
9
An efficient algorithm for fast parasitic extraction and passive order reduction of 3D interconnect models
Published in Proceedings Design, Automation and Test in Europe (1998)“…As VLSI circuit speeds have increased, the need for accurate three-dimensional interconnect models has become essential to accurate chip and system design. In…”
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Conference Proceeding -
10
Interconnect parasitic extraction in the digital IC design methodology
Published in Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design (07-11-1999)“…Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis…”
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Conference Proceeding -
11
Interconnect parasitic extraction in the digital IC design methodology
Published in 1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051) (1999)“…Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis…”
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Conference Proceeding Journal Article -
12
FastPep: a fast parasitic extraction program for complex three-dimensional geometries
Published in Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design (13-11-1997)“…In this paper we describe a computationally efficient approach to generating reduced-order models from PEEC-based three-dimensional electromagnetic analysis…”
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Conference Proceeding -
13
Generating compact, guaranteed passive reduced-order models of 3-D RLC interconnects
Published in IEEE transactions on advanced packaging (01-11-2004)“…As very large scale integration (VLSI) circuit speeds and density continue to increase, the need to accurately model the effects of three-dimensional (3-D)…”
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14
A coordinate-transformed Arnoldi algorithm for generating guaranteed stable reduced-order models of RLC circuits
Published in Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design (01-01-1997)“…Since the first papers on asymptotic waveform evaluation (AWE), Pade-based reduced order models have become standard for improving coupled circuit-interconnect…”
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Conference Proceeding -
15
Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures
Published in Annual ACM IEEE Design Automation Conference: Proceedings of the 32nd ACM/IEEE conference on Design automation; 12-16 June 1995 (01-01-1995)Get full text
Conference Proceeding -
16
Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-05-1996)“…Reduced-order modeling techniques are now commonly used to efficiently simulate circuits combined with interconnect, but generating reduced-order models from…”
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Journal Article Conference Proceeding -
17
Automatic generation of accurate circuit models of 3-D interconnect
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-08-1998)“…In order to optimize high-speed systems, designers need tools that automatically generate reduced order SPICE compatible models from geometric descriptions of…”
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A mixed nodal-mesh formulation for efficient extraction and passive reduced-order modeling of 3D interconnects
Published in Annual ACM IEEE Design Automation Conference: Proceedings of the 35th annual conference on Design automation; 15-19 June 1998 (01-05-1998)“…As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate three-dimensional interconnect models. In…”
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Conference Proceeding -
19
Algorithms for coupled transient simulation of circuits and complicated 3-D packaging
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01-02-1995)“…Techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on…”
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20
Algorithms for coupled transient simulation of circuits and complicated 3-D packaging
Published in 1994 Proceedings. 44th Electronic Components and Technology Conference (1994)“…In this paper techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is…”
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Conference Proceeding