Search Results - "Kamon, Mattan"

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  1. 1

    Human–machine collaboration for improving semiconductor process development by Kanarik, Keren J., Osowiecki, Wojciech T., Lu, Yu (Joe), Talukder, Dipongkar, Roschewsky, Niklas, Park, Sae Na, Kamon, Mattan, Fried, David M., Gottscho, Richard A.

    Published in Nature (London) (27-04-2023)
    “…One of the bottlenecks to building semiconductor chips is the increasing cost required to develop chemical plasma processes that form the transistors and…”
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    Journal Article
  2. 2

    Continuation-Based Pull-In and Lift-Off Simulation Algorithms for Microelectromechanical Devices by Zheng Zhang, Kamon, Mattan, Daniel, Luca

    Published in Journal of microelectromechanical systems (01-10-2014)
    “…The voltages at which microelectromechanical actuators and sensors become unstable, known as pull-in and lift-off voltages, are critical parameters in…”
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    Journal Article
  3. 3
  4. 4

    Efficient Reduced-Order Modeling of Frequency-Dependent Coupling Inductances associated with 3-D Interconnect Structures by L. Miguel Silveira, Mattan Kamon

    Published in 32nd Design Automation Conference (1995)
    “…Since the first papers on asymptotic waveform evaluation (AWE), reduced order models have become standard for improving interconnect simulation efficiency, and…”
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    Conference Proceeding
  5. 5

    FASTHENRY: a multipole-accelerated 3-D inductance extraction program by Kamon, M., Tsuk, M.J., White, J.K.

    “…A mesh analysis equation formulation technique combined with a multipole-accelerated Generalized Minimal Residual (GMRES) matrix solution algorithm is used to…”
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    Journal Article
  6. 6

    A coordinate-transformed Arnoldi algorithm for generating guaranteed stable reduced-order models of RLC circuits by Silveira, L. Miguel, Kamon, Mattan, Elfadel, Ibrahim, White, Jacob

    “…Since the first papers on asymptotic waveform evaluation (AWE), Padé-based reduced order models have become standard for improving coupled circuit-interconnect…”
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    Journal Article
  7. 7

    Extraction of Frequency Dependent Macromodels for Mems Squeezed-Film Damping Effects by Joseph Yang, Yao-Joe, Chien, Chih-Ming, Kamon, Mattan, Rabinovich, Vladimir L., Gilbert, John R.

    Published in Journal of mechanics (01-12-2005)
    “…In this paper, an efficient macromodel extraction technique for dynamical MEMS gas damping effects is presented. The technique applies an Arnoldi-based…”
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    Journal Article
  8. 8

    FastPep: a fast parasitic extraction program for complex three-dimensional geometries by Kamon, Mattan, Marques, Nuno, White, Jacob

    “…In this paper we describe a computationally efficient approach to generating reduced-order models from PEEC-based three-dimensional electromagnetic analysis…”
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    Conference Proceeding Journal Article
  9. 9

    An efficient algorithm for fast parasitic extraction and passive order reduction of 3D interconnect models by Marques, N., Kamon, M., White, J., Silveira, L.M.

    “…As VLSI circuit speeds have increased, the need for accurate three-dimensional interconnect models has become essential to accurate chip and system design. In…”
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    Conference Proceeding
  10. 10

    Interconnect parasitic extraction in the digital IC design methodology by Kamon, Mattan, McCormick, Steve, Sheperd, Ken

    “…Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis…”
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    Conference Proceeding
  11. 11

    Interconnect parasitic extraction in the digital IC design methodology by Kamon, M., McCormick, S., Shepard, K.

    “…Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis…”
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    Conference Proceeding Journal Article
  12. 12

    FastPep: a fast parasitic extraction program for complex three-dimensional geometries by Kamon, Mattan, Marques, Nuno, White, Jacob

    “…In this paper we describe a computationally efficient approach to generating reduced-order models from PEEC-based three-dimensional electromagnetic analysis…”
    Get full text
    Conference Proceeding
  13. 13

    Generating compact, guaranteed passive reduced-order models of 3-D RLC interconnects by Marques, N.A., Kamon, M., Silveira, L.M., White, J.K.

    Published in IEEE transactions on advanced packaging (01-11-2004)
    “…As very large scale integration (VLSI) circuit speeds and density continue to increase, the need to accurately model the effects of three-dimensional (3-D)…”
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    Journal Article
  14. 14

    A coordinate-transformed Arnoldi algorithm for generating guaranteed stable reduced-order models of RLC circuits by Silveira, L. Miguel, Kamon, Mattan, Elfadel, Ibrahim, White, Jacob

    “…Since the first papers on asymptotic waveform evaluation (AWE), Pade-based reduced order models have become standard for improving coupled circuit-interconnect…”
    Get full text
    Conference Proceeding
  15. 15
  16. 16

    Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures by Miguel Silveira, L., Kamon, M., White, J.

    “…Reduced-order modeling techniques are now commonly used to efficiently simulate circuits combined with interconnect, but generating reduced-order models from…”
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    Journal Article Conference Proceeding
  17. 17

    Automatic generation of accurate circuit models of 3-D interconnect by Kamon, M., Marques, N.A., Silveira, L.M., White, J.

    “…In order to optimize high-speed systems, designers need tools that automatically generate reduced order SPICE compatible models from geometric descriptions of…”
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    Journal Article
  18. 18

    A mixed nodal-mesh formulation for efficient extraction and passive reduced-order modeling of 3D interconnects by Marques, Nuno, Kamon, Mattan, White, Jacob, Silveira, L. Miguel

    “…As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate three-dimensional interconnect models. In…”
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    Conference Proceeding
  19. 19

    Algorithms for coupled transient simulation of circuits and complicated 3-D packaging by Silveira, L.M., Kamon, M., White, J.

    “…Techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is based on…”
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    Journal Article Conference Proceeding
  20. 20

    Algorithms for coupled transient simulation of circuits and complicated 3-D packaging by Silveira, L.M., Kamon, M., White, J.

    “…In this paper techniques are described for coupled simulation of complicated 3-D interconnect and nonlinear transistor drivers and receivers. The approach is…”
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    Conference Proceeding