Search Results - "Kamimura, Rikiya"

High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding by Tatsumi, Kohei, Morisako, Isamu, Wada, Keiko, Fukuomori, Minoru, Iizuka, Tomonori, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Hikita, Masayuki, Kamimura, Rikiya, Kawanabe, Naoki, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…New bonding technologies, which can deliver high-temperature thermal resistance that replaces solder bonding or Al wire bonding, have been strongly expected in…”
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Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application by Tatsumi, Kohei, Inagaki, Masakazu, Kamei, Kazuhito, Iizuka, Tomonori, Narimatsu, Hiroaki, Sato, Nobuaki, Shimizu, Koji, Ueda, Kazutoshi, Imakiire, Akihiro, Hikita, Masayuki, Kamimura, Rikiya, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Toda, Keiji

“…Aiming for application to the inverter system of HEV and EV, we have developed a novel packaging technique for SiC power devices based on Nickel Micro Plating…”
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An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead and Electrodes by Fukui, Naoki, Koshiba, Keiko, Miyazaki, Itaru, Morisako, Isamu, Iizuka, Tomonori, Itose, Tomoya, Hikita, Masayuki, Kamimura, Rikiya, Tatsumi, Kohei

“…As for the IGBT power device based on Si used for the vehicle, the performance limit of the Si semiconductor has been pointed out, and the SiC semiconductor…”
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A New High-Reliable Thick Film System for Automotive Use by Kamimura, Rikiya, Totokawa, Masashi, Nomura, Tohru, Shiraishi, Yoshihiko, Kitagaki, Takashi, Shibata, Hiroshi

“…This paper describes the development processes of a highly reliable thick film system for automotive use. There are mainly two thick film systems for…”
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